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45 entries
The Tegal 901G is a diode plasma etcher specially configured for GaAs processing and used for etching high-performance devices on gallium arsenide substrates.
The Tegal i90X is a plasma etch system based on the production-proven Tegal 900-series platform, with unlimited recipes, 20X fine set-point control, and a Windows NT touchscreen control system.
The Tegal 9XX is a series of etchers.
The Tegal 903 is an etcher in the Tegal 9XX Series Etchers.
The Tegal Plasmaline 411 is a plasma asher listed among Tegal plasma processing equipment and parts. The Tegal Plasmaline 411 is associated in the source text with asher, plasma oven, and AR O2 etcher descriptions.
The Tegal 703 is a plasma inline etcher mentioned in equipment and parts listings.
The Tegal 703 RPPS is a plasma inline etcher referenced in source material from Tegal equipment listings.
The Tegal 3200 SE is an advanced cluster platform for 3D IC and MEMS applications that can be configured with up to 3 process modules.
The Tegal 4200 SE is an advanced cluster platform for 3D IC and MEMS applications.
The Tegal 200 SE is a DRIE system described as suited for 3D-SiP and MEMS volume manufacturing.
The Tegal 901 is an etcher for non-critical silicon nitride, photoresist trim, and poly etching.
The Tegal 421 (Plasmaline 421) is a barrel-type oxygen plasma asher used for photoresist stripping.
The Tegal 903 E Dry is a dry etcher designed for 6-inch wafers.
The Tegal 915 is a Tegal 9XX Series etcher.
Tegal 980 ACS is a plasma etch system series described as serving the 200mm fab line.
The Tegal 415 RFG is a plasma asher introduced in 1981.
The Tegal 9XX is a series of etchers that includes the Tegal 901, Tegal 903, and Tegal 915 models.
The Tegal T915 is a resist asher (asher) for semiconductor wafer processing.
The Tegal 6500 HRe- is a dual-frequency etch system series for plasma etching. The Tegal 6500 HRe- uses high-density, capacitively coupled plasma generation and magnetic plasma confinement for precise etching down to the sub-micron level.
The Tegal PLASMALINE MODEL 421 is a plasma etcher/asher.
The Tegal 981ACS is a scaled-up version of the 901ACS diode RIE system built for handling 150 mm and 200 mm wafers and large-area etching operations.
The Tegal 901ACS is a wide-gap diode reactor system for plasma etch operations on semiconductor substrates and wafers.
The Tegal 903ACS is a narrow gap diode reactor system for semiconductor etching of silicon, Ga-As, In-P, and Si-Ge substrates.
The Tegal 803 is an inline automatic wafer RF plasma etcher.
The Tegal 701 is a plasma line RF plasma etcher referenced as part of Tegal plasma inline equipment.
The Tegal 1512e is an industrial RIE plasma etcher system with modules assembly for CI-4222.
The Tegal 6550 is a plasma etch reactor/system for etching non-volatile metal and metal oxide films, with a dual-chamber platform and patented rinse-strip-rinse capability.
The Tegal 900 is a plasma etch system used for applications including defreckling, backside nitride etching, and processing III-V materials.
The Tegal 903 ACS is a diode plasma etch tool for semiconductor processing with a wafer size range of 3 inches, 100 mm to 150 mm.
The Tegal 915 is a plasma barrel etcher with batch capacity for 100 mm, 125 mm, and 150 mm wafers.
The Tegal 6510 is a high-density CCP plasma etch tool with dual-frequency RF power application and magnetic plasma confinement.
The Tegal 6520 is a high-density CCP plasma etch tool with dual-frequency RF power application and magnetic plasma confinement.
The Tegal 900e Series is a single-wafer cassette-to-cassette plasma etch system for non-critical plasma etch processes on 3 in to 150 mm wafers.
The Tegal 6540 is a high-density plasma etch system used for etching difficult-to-etch materials in MEMS and related semiconductor applications.
The Tegal 901e is a diode plasma etcher used for GaAs and other semiconductor applications, with source-described substrate handling for 75 mm to 150 mm round wafers and some rectangular substrates.
The Tegal 903e is a diode plasma etch tool used for applications including oxide etching and other semiconductor and compound-semiconductor etch processes.
The Tegal 983 is a diode plasma etch tool for pad passivation, oxide contact/via, spacer, polyimide ILD, and resist/SOG planarization applications.
The Tegal 1511e is a tri-electrode dual-frequency plasma etch system for processing three- to six-inch wafers.
The Tegal 981 is a plasma etch tool for thin film head fabrication, described as achieving precise photoresist descum with 4:1 anisotropy at low processing temperatures in oxygen-free plasmas.
The Tegal 900ACS is a single-wafer cassette-to-cassette non-critical plasma etch system for 75mm to 200mm wafers.
The Tegal T 903 E Plasma RIE is a reactive ion etcher in the Etch category.
The Tegal 6500 is a 2-chamber nitride etch system.
The Tegal 6500 U is a 2-chamber nitride etcher.
General referenceThe Tegal 90 X is an etch system designed for semiconductor fabrication, representing a class of dry plasma etching equipment used to remove material from wafer surfaces with high precision.
The Tegal 110 SE is a compact, flexible plasma etch system for process development applications, with deep silicon etching capabilities for MEMS and 3D-IC components.