Tegal
3200
The Tegal 3200 SE is an advanced, world class cluster platform. The Tegal 3200 SE is dedicated to 3D IC and MEMS applications. The Tegal 3200 SE can accommodate wafer sizes from 100 to 200 mm with a quick size change kit.[1]
What it is
How it works
The Tegal 3200 cluster tool may be configured on request for Silicon (Si), Silicon On Insulator (SOI), and Silicon Dioxide (SiO2). The system is able to provide a wide range of processes with high etch rate, high mask selectivity, excellent etch uniformity, and profile control.[1]
Where it fits in the process flow
Applications
The Tegal 3200 SE is dedicated to 3D IC and MEMS applications.[1]
Configured materials include Silicon (Si), Silicon On Insulator (SOI), and Silicon Dioxide (SiO2).[1]
- MEMS
- semiconductor device fabrication
What do the numbers mean?
Wafer handling2
Optics & imaging1
- process attributes
- High etch rate, high mask selectivity, excellent etch uniformity, and profile control[1]
Configuration & options3
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| 3200 SE | — | — | Configured with up to 3 process modules; accommodates wafer sizes from 100 to 200 mm with a quick size change kit; configurable for Silicon (Si), Silicon On Insulator (SOI), and Silicon Dioxide (SiO2). | web.archive.org[1] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes does the Tegal 3200 SE support?
The system supports wafer sizes from 100 mm to 200 mm with a quick size change kit.[1]
How many process modules can be configured on the 3200 SE?
The system can be configured with up to three process modules for mass production.[1]
What applications is the 3200 SE designed for?
The platform is dedicated to 3D IC and MEMS applications.[1]
What performance characteristics does the 3200 SE offer?
The system provides high etch rate, high mask selectivity, excellent etch uniformity, and profile control.[1]
Not publicly documented
The following facts about the 3200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 3200 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 3200 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 3200 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 3200 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 3200 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
Last updated Sep 23, 2026.