Tegal
The Tegal 903 ACS is a diode plasma etch tool. The Tegal 903 ACS has a wafer size range of 3", 100mm – 150mm. The Tegal 903 ACS is suited to plasma etch of silicon oxide and silicon nitride materials.[1]

Process applications and technology nodes documented for this tool.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
The Tegal 903 uses a narrow gap RF diode reactor.[1]
Typical applications include pad passivation etch, oxide contact/via etch (down to 0.8 micron), LDD spacer etch, polyimide ILD etch, and resist/SOG planarization. The system is also used for MEMS, advanced packaging, thin film head, and Bio-Chip nanotechnology.[1][3]
The following facts about the 903 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 903 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 903 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 903 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 903 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 903 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Last updated Oct 5, 2026.
The Tegal 6510 is a high-density CCP plasma etch tool with dual-frequency RF power application and magnetic plasma confinement.
The Tegal 6520 is a high-density CCP plasma etch tool with dual-frequency RF power application and magnetic plasma confinement.
The Tegal 6540 is a high-density plasma etch system used for etching difficult-to-etch materials in MEMS and related semiconductor applications.
The Tegal 6550 is a plasma etch reactor/system for etching non-volatile metal and metal oxide films, with a dual-chamber platform and patented rinse-strip-rinse capability.