Tegal
The Tegal 1511e is a tri-electrode dual-frequency plasma etch tool. The Tegal 1511e processes three- to six-inch wafers and was first sold in 1984. The Tegal 1511e was Tegal's first vacuum-loadlocked dual-frequency tri-electrode etch system.[1]

Process applications and technology nodes documented for this tool.
First sold in 1984.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
The Tegal 1511e is a tri-electrode dual-frequency plasma etch system.[1][2]
The Tegal 1511e is used for etching films in semiconductor, telecommunications, and optoelectronic device manufacturing, including high-performance wireless and data applications.[1]
The following facts about the 1511e are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the 1511e are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 1511e are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 1511e are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 1511e is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 1511e are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Last updated Sep 22, 2026.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.