Waferpedia

Zygo

Z3D-7000

Metrology & Inspection200mm5th generationZygo Z3D-7000 family
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Z3D-7000 — web.archive.org
Fig. 01Z3D-7000web.archive.org[1]

What it is

The Zygo Z3D-7000 is a non-contacting, non-destructive optical metrology system designed for production wafers. The system accommodates 200 mm and 300 mm wafer sizes and can be configured as a bridge tool to handle both sizes simultaneously. Wafers are loaded via FOUPs and/or open cassettes. The Z3D-7000 incorporates Zygo's fifth-generation interferometric technology and is ISO Class 2, S2/S8, and CE certified with SEMI E95 compliant software. The system uses modular IntelliSensors to reduce mean time between repairs.[1][2]

How it works

The Z3D-7000 uses a high-precision stage and Zygo's 'OneShot' processing algorithms to simultaneously measure multiple parameters including film thickness, critical dimensions, overlay, trench depth, and general surface topography. The system's 'TopSlice' and 'FilmSlice' analysis capabilities isolate the top surface topography of multilayer films and can calculate film thickness maps. The long scan range and encoder technology on the z-axis enable measurement of wafer curvature for film stress tracking. The measurement data shows high correlation with contact techniques such as atomic force microscopes and stylus profilers.[1][2]

What can it run?

Process applications and technology nodes documented for this tool.

  • Process control
  • Photolithography
  • Etch
  • Bumping processes
  • Transistor formation
  • Interconnect
  • Film thickness measurement
  • Critical dimensions measurement
  • Overlay measurement
  • Laser scribe measurement
  • Wafer curvature measurement
  • Film stress tracking

What do the numbers mean?

Wafer handling5

Wafer sizes
200 mm and 300 mm wafers[1]
Accurate?
Bridge-tool configuration
Can be configured to simultaneously handle both wafer sizes[1]
Accurate?
Loaded wafers
FOUPS and/or open cassettes[1]
Accurate?
Wafer sizes
200 mm and 300 mm, bridge tool configuration available[1]
Accurate?
Wafer loading
FOUPS and/or open cassettes, pre-alignment, super flat chuck[1]
Accurate?

Optics & imaging1

Measurement type
Non-contacting, non-destructive optical metrology[1]
Accurate?

Performance3

Throughput
Exceeds throughput of contact technologies (profilers, atomic force microscopes) by a factor of 10[1]
Accurate?
Simultaneous measurements
Film thickness, critical dimensions, overlay, trench depth, and general surface topography[1]
Accurate?
Precision
Sub-nanometer precision for critical etch depth processes[1]
Accurate?

Control & software4

Key features
High speed non-contacting metrology; simultaneously measures multiple parameters; ISO Class 2, S2/S8, and CE certified; SEMI E95 compliant software; modular IntelliSensors reduce MTBR[1]
Accurate?
Software
MetroPro software[1]
Accurate?
Software
MetroPro[1]
Accurate?
Software compliance
SEMI E95 compliant[1]
Accurate?

Configuration & options5

Technology
ZYGO's fifth generation interferometric technology[1]
Accurate?
Technology
Fifth generation interferometric technology[1]
Accurate?
Certifications
ISO Class 2, S2/S8, CE certified[1]
Accurate?
Modular sensors
IntelliSensors reduce MTBR[1]
Accurate?
Algorithms
OneShot, TopSlice, FilmSlice[1]
Accurate?
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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What wafer sizes does the Z3D-7000 support?

The Z3D-7000 accommodates 200 mm and 300 mm wafers and can be configured as a bridge tool to handle both sizes simultaneously.[1][2]

What software does the Z3D-7000 use?

The system uses MetroPro software, which provides a suite of measurement, control, data analysis, and processing options including 2D and 3D plots, reports, and statistics.[1][2]

What certifications or standards does the Z3D-7000 comply with?

The system is ISO Class 2, S2/S8, and CE certified, and its software is SEMI E95 compliant.[1][2]

How does the Z3D-7000 compare to contact metrology tools?

The Z3D-7000 achieves throughput that exceeds contact technologies such as profilers or atomic force microscopes by as much as a factor of 10, while maintaining high correlation with those measurement techniques.[1]

Not publicly documented

The following facts about the Z3D-7000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Z3D-7000 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Z3D-7000 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Z3D-7000 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Z3D-7000 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Z3D-7000 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]Z3D-7000 — Zygo | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
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Last updated Oct 5, 2026.

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