EV Group
EVG40
The EVG40 is a top-to-bottom side alignment accuracy measurement system from EV Group. The EVG40 uses non-destructive, visible light, self-calibrating technology. The EVG40 offers absolute alignment accuracy better than 0.5 µm with a statistical probability of 99%.[1][2]
Wafer size
200mm
Optics
High power objectives from 5x to 50x[1]
What it is
The EVG40 is a metrology and inspection system for top-to-bottom side alignment accuracy measurement. The EVG40 is a PC-based measurement system with manual to fully automated versions.[1]
The EVG®40 NT is an automated measurement system for bonding and lithography metrology. The EVG®40 D2W is a die-to-wafer overlay metrology system for die overlay measurement after bonding.[3][4]
How it works
The EVG40 uses non-destructive, visible-light, self-calibrating measurement technology. The EVG40 supports repeatable top-to-bottom side alignment accuracy measurement.[1]
The EVG40 family uses alignment-stage optics, image recognition, and measurement modes for transparent overlay and linewidth measurement. The EVG®40 NT adds a top-to-bottom-side microscope, critical dimension measurement, die-to-die alignment verification, and multilayer thickness measurement.[1][3]
The EVG®40 D2W uses state-of-the-art optics and image processing algorithms for overlay measurement. The EVG®40 D2W supports laterally measured side-by-side fiducials and vertically measured targets through dual-focus optics and infrared light.[4]
Where it fits in the process flow
The EVG40 sits in inspection and metrology after alignment-critical lithography or bonding steps. The EVG®40 NT is used to verify lithography-relevant parameters and bond alignment accuracy.[1][3]
The EVG®40 D2W sits after die-to-wafer bonding for overlay verification. The EVG®40 D2W is intended for high-volume manufacturing environments and process control in advanced packaging.[4]
Applications
The EVG40 accepts any wafer or substrate material up to 200 mm. The EVG40 family includes configurations for standard, advanced, semi-automated, and fully automated operation.[1]
The EVG®40 NT is used for bonding and lithography metrology, critical dimension measurement, die-to-die alignment verification, and multilayer thickness measurement. The EVG®40 D2W supports die-to-wafer overlay measurement for heterogeneous integration, fan-out wafer-level packaging, 2.5D and 3D integration, and chiplet-based architectures.[3][4]
The EVG40 family uses high-power objectives from 5x to 50x. The EVG40 family is specified for absolute accuracy below 0.5 µm with a statistical probability of 99 percent.[1]
What do the numbers mean?
Wafer handling4
- Semi-automated basic unit
- Alignment stage optics; advanced features include image recognition system, quick transparent overlay, and linewidth measurement mode; automation features include programmable microscope stage rack and motorized chuck rotation[1]
- Fully-automated basic unit
- Alignment stage optics; advanced features include image recognition system, quick transparent overlay, and linewidth measurement mode; automation features include programmable microscope stage rack, motorized chuck rotation, and robotic autoload cassette-to-cassette[1]
Optics & imaging3
- Advanced basic unit
- Alignment stage optics; advanced features include image recognition system, quick transparent overlay, and linewidth measurement mode[1]
Performance7
- Measured parameters (NT variant)
- Lithography-relevant parameters like critical dimensions, as well as bond alignment accuracy[3]
- Measurement methods (NT variant)
- Critical dimension (CD) measurement, die-to-die alignment verification, multi-layer thickness measurement[3]
- Measurement accuracy (NT variant)
- High measurement accuracy in vertical and lateral direction[3]
- Overlay measurement (D2W variant)
- 100 percent die overlay measurement with high precision[4]
Control & software1
Configuration & options2
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| EVG40 Standard | — | — | Basic unit with alignment stage optics | web.archive.org[1] |
| EVG40 Advanced | — | — | Basic unit with alignment stage optics and advanced features including image recognition system, quick transparent overlay, and linewidth measurement mode | web.archive.org[1] |
| EVG40 Semi-Automated | — | — | Basic unit with alignment stage optics and advanced features including image recognition system, quick transparent overlay, linewidth measurement mode, programmable microscope stage rack, and motorized chuck rotation | web.archive.org[1] |
| EVG40 Fully-Automated | — | — | Basic unit with alignment stage optics and advanced features including image recognition system, quick transparent overlay, linewidth measurement mode, programmable microscope stage rack, motorized chuck rotation, and robotic autoload cassette-to-cassette | web.archive.org[1] |
| EVG40 AUTOMATED | — | — | Mentioned as a field-upgrade target from the semi-automated version | web.archive.org[1] |
| EVG40 Standard Basic Unit | — | — | Alignment Stage Optics | web.archive.org[1] |
| EVG40 Advanced Basic Unit | — | — | Alignment Stage Optics; Advanced Features: Image Recognition System, Quick Transparent Overlay, Linewidth Measurement Mode | web.archive.org[1] |
| EVG40 Semi-Automated Basic Unit | — | — | Alignment Stage Optics; Advanced Features: Image Recognition System, Quick Transparent Overlay, Linewidth Measurement Mode; Automation Features: Programmable Microscope Stage Rack, Motorized Chuck Rotation | web.archive.org[1] |
| EVG40 Fully-Automated Basic Unit | — | — | Alignment Stage Optics; Advanced Features: Image Recognition System, Quick Transparent Overlay, Linewidth Measurement Mode; Automation Features: Programmable Microscope Stage Rack, Motorized Chuck Rotation, Robotic Autoload Cassette-to-Cassette | web.archive.org[1] |
| EVG40 NT | — | — | Stand-alone automated measurement system enabling measurement of lithography-relevant parameters like critical dimensions, as well as bond alignment accuracy; top-to-bottom side microscope; PC-based measurement and pattern recognition software | evgroup.com[3] |
| EVG40 NT2 | — | — | Referenced as EVG's industry benchmark system against which the EVG40 D2W achieves up to 15X higher throughput | evgroup.com[4] |
| EVG40 D2W | — | — | Die-to-wafer overlay metrology platform for 100 percent die overlay measurement; dual focus optics, infrared light, universal measurement process, up to 5-parameter overlay model | evgroup.com[4] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the EVG40 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the EVG40 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the EVG40 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the EVG40 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the EVG40 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the EVG40 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]EVG40 — EV Group | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [3]evgroup.com — evgroup.comevgroup.com
- [4]evgroup.com — evgroup.comevgroup.com
Last updated Oct 5, 2026.
Compare with similar tools
View all →
The KLA Archer 10 XT Overlay System is a 200mm overlay metrology system with refurbishment-upgraded components and software version 5.6.
Veeco Dektak 150 is a stylus-based surface profiler used for measuring surface topography and thin film step heights.
The KLA Tencor P-15 is a profilometer with a 200 mm sample table with vacuum.
The KLA Tencor P-2 is a profilometer with a 200 mm sample table with vacuum and a 3D scan option.