SUSS MicroTec
MA200 Gen3
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The SUSS MicroTec MA200 Gen3 is a fully automated mask aligner. The SUSS MicroTec MA200 Gen3 is engineered for wafers and square substrates up to 200 mm. The SUSS MicroTec MA200 Gen3 provides mask alignment and exposure for high-volume lithography.[1][2]
What it is
How it works
The MA200 Gen3 aligns the mask to the wafer and exposes the substrate with automated handling and exposure control. The MA200 Gen3 supports proximity, contact, and vacuum exposure modes.[1][4][5][2]
The MA200 Gen3 uses DirectAlign with PatMax for live-image alignment. The MA200 Gen3 uses MO Exposure Optics, telecentric illumination, and a temperature-stabilized chuck and mask system for process stability.[1][4][5]
Where it fits in the process flow
The MA200 Gen3 fits in front-end and backend lithography where pattern transfer is needed on wafers or square substrates. The MA200 Gen3 is positioned for MEMS, RF and power devices, advanced packaging, 3D patterning, and image sensor work.[1][4][2]
The MA200 Gen3 supports high-volume automated production. The MA200 Gen3 includes automated mask management and handling features for fragile, warped, and ultra-thin substrates.[1][4][5]
Applications
The MA200 Gen3 is used for MEMS, radio frequency devices, power devices, advanced packaging, compound semiconductors, and image sensors. The MA200 Gen3 is also suited to 3D integration, fan-out, bumping, and wafer-level packaging work.[1][4][5][2]
The MA200 Gen3 is used for thick resist photolithography and for processing warped or fragile substrates. The MA200 Gen3 supports sub-micron alignment and exposure modes for fine-feature patterning.[1][4][5]
- Mask Alignment
- Exposure
What do the numbers mean?
Vacuum & pumping2
- Exposure modes
- Proximity, contact, soft contact, hard contact, and vacuum contact exposure[3]
Wafer handling3
Optics & imaging4
Performance1
Configuration & options1
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the MA200 Gen3 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MA200 Gen3 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the MA200 Gen3 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the MA200 Gen3 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MA200 Gen3 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the MA200 Gen3 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]suss.com — suss.comsuss.com
- [2]hilpert.ch — hilpert.chhilpert.ch
- [3]inseto.cominseto.com
- [4]MA200 Gen3 | SUSS — suss.comsuss.com
- [5]http://tstvn.com/wp-content/uploads/2021/08/Catalog-mask-aligner-ma200gen3.pdf — tstvn.comtstvn.com
Last updated Oct 9, 2026.
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