Lithography

The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.

The KLA FT-750 is a visible light spectrophotometer-based thin film measurement system for semiconductor process control.

The Laurell SU-8 is a spin station dedicated to applying SU-8 photoresist for lithography processes.

The SUSS MicroTec MA 8 / BA 6 Wafer is a wafer aligner categorized under Lithography.

The ASML PAS 5500/850 D is a scanner for 6-inch wafers, using a Cymer ELS-6610 light source and supporting R type, 1.2 mm notch and flat wafers.

Heidelberg Instruments VPG200 is a laser pattern generator used for mask production, direct exposure on SEMI-standard wafers, and mask reticles.

The SUSS MicroTec MJB4 is a manual mask/wafer aligner for research and development that aligns and exposes wafers up to 4 inch (100 mm) diameter.

The EVG 6200 NT is a semi automated bottom side alignment system with double-side operation and manual handling.

The SUSS ACS200 GEN3 is a modular cluster tool for coating and development of i-line photoresists.

The Quintel Q 4000 Mask is a lithography mask aligner.

The EVG 150 is a modular cluster tool for coating and development of i-line photoresists.

The Nanoscribe Photonic Professional GT+ is a 3D nanoprinter for two-photon polymerization using an infrared 780 nm femtosecond laser.

The Canon FPA 2500 i 2 is a stepper for semiconductor lithography, with documented vintages of 1993 and 1994.

The Hamatech HMR900 is a mask processor for Cr-plate wet processing or cleaning.

The ASML Twinscan XT 1700 i Immersion Scanner is a 193nm immersion lithography system described as being used for volume chip production at 45nm mode.

The SUSS MA 200 is a semi-automatic mask aligner capable of processing wafers up to 8 inches in diameter, using UV400 optics and a 365/405 nm sensor.

The ASML PAS 5500/350C is a DUV stepper for photolithography, typically used in a cluster with a TEL Clean Track ACT-8 coater/developer for 100 mm wafers. The system dates from 1997.

The EVG EV 640 is a mask aligner for 6- and 8-inch wafers.

The Nikon S 306 C is an 8-inch lithography scanner with ArF excimer laser exposure at 193 nm.

The ASML PAS 5500 275 i-Line is an i-line stepper for 8 inch wafers.

The ASML Twinscan NXT 1980 i is a 12-inch wafer lithography scanner that was upgraded from the 1970i model.

The SUSS 150 e is a mask aligner manufactured by SUSS MicroTec.

The Canon FPA 5510 iZ is an i-line stepper for 12-inch wafer processing.

The Varian P/N: E 11003911 is a scanner assembly.

ASML PAS 5000 / 55 A is a stepper identified with an option set that includes Wafer Tilt Monitor.

The Nikon NSR 2005 G 8 C is a G-line stepper introduced in 1991.

The ASML XT 1250 D is a lithography scanner.

The ASML Twinscan XT 400 F is an i-line scanner for 300 mm wafers.

The ASML PAS 5500 / 700 is a Scanner and a Stepper.

The ASML Twinscan 1200 B is a lithography scanner equipped with a Cymer XLA 160 laser, but it is non-operational due to an internal water leak near the lens and has no lens data available.

The ASML PAS 5500/400 is an i-line stepper for 8-inch wafers with a resolution of 280nm, introduced around 2002.

The Canon FPA 3030 i 5 + i-Line Stepper is a stepper used in photolithography for 6-inch wafers.

The PAS 2500 series was the first lithography system developed entirely by ASML and became the system that built the company.

The Nikon 1505 G 7 E is a stepper used in lithography on 6-inch wafers with a 5-inch reticle.

The Tokyo Electron CLEAN TRACK Lithius i+ is a 300 mm coater/developer track used for photoresist coating and developing and for spin-coating underlayer films in lithography processes.

The ASML TWINSCAN NXE:3400B is an extreme ultraviolet (EUV) lithography scanner designed for volume production at the 7 and 5 nm nodes.

The GCA 8500 is a commercial wafer stepper from GCA that performs 5x-reduction i-line photolithography, accepts 150 mm wafers, and resolves sub-micron features.

The Micralign was a family of projection aligners introduced in 1973 by Perkin-Elmer.

The Karl Suss MA6 is a high-resolution semi-automated photolithography mask aligner for research, development, and small-volume production.

The EVG 6200 Mask Aligner is a lithography tool configured for 6-inch and 8-inch wafers.

The PAS 2400 is an early photolithography system from ASML that was demonstrated in 1985 and achieved a throughput of 90 wafers per hour.

The Ultratech AP 300 E is a stepper used in lithography.

The MJB55 is a mask aligner developed by SUSS MicroTec (then Karl Süss) for photolithography in mass production.

ASML Twinscan XT 1950 Hi is a scanner for 12-inch wafers used for 193 nm immersion lithography with 38 nm resolution capacity.

The MA12 Gen3 is a mask alignment system for photolithography listed under SUSS MicroTec's imaging solutions.

Canon FPA 5000 ES 3 is a lithography stepper identified with a Cymer ELS 6300 Laser and a Rasco BCU 900 Brine Chilling Unit.

The DSC300 Gen3 is a UV scanning mask alignment system from SUSS MicroTec.

The SUSS MicroTec DSC300 Gen2 is an automated full-field scanning projection lithography system for wafers up to 300 mm.

The DSC500 is an automated, full-field scanning projection lithography system from SUSS MicroTec for substrates up to 450 x 500 mm.

The SUSS MJB 4 Mask Aligner is a mask aligner used for contact exposure and alignment, with source-stated support for wafers up to 4 inches in diameter.