Comparison ledger
Oxford Instruments 100 ICP Fluorine, Tegal 1511e, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100 ICP FluorineOxford Instruments | 1511eTegal |
|---|---|---|
| OEM | Oxford Instruments | Tegal |
| Category | Etch | Etch |
| Wafer size | — | three- to six-inch wafers |
| Process node | — | — |
| Introduced | — | 1984 |
| Production run | — | 1984– |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Oxford Instruments 100 ICP Fluorine | Tegal 1511e |
| Specifications | ||
| Etch Gases | SF6, CF4, O2, Ar, N2, CHF3, C4F8[1] | — |
| Cryo DRIE etch rate | up to 5 µm/min[1] | — |
| Wafer size | 4 inch, 6 inch, 8 inch (with clamp change)[1] | — |
| tool type | — | tri-electrode dual-frequency plasma etch system[2] |
| wafer size | — | three- to six-inch wafers[2] |
| first sold | — | 1984[2] |
| system characteristic | — | first vacuum-loadlocked dual-frequency tri-electrode etch system[2] |
| First vacuum-loadlocked dual-frequency tri-electrode etch system | — | Yes[2] |
Plan your fab
Building a Etch process? Get a complete equipment list.
Open the fab equipment planner →