Plasma-Therm
Versaline VCX 600 ICP
The Plasma-Therm Versaline VCX 600 is an inductively coupled plasma (ICP) etching system. The Versaline VCX 600 is configured for 6-inch wafer processing. The Versaline VCX 600 includes an ENI MKS GMW25 source generator, chillers, transformer, and pumps.[1][2]
What it is
General reference — not yet source-verifiedThe Plasma-Therm Versaline VCX 600 ICP is a plasma etch system for semiconductor manufacturing.
How it works
General reference — not yet source-verifiedAn inductively coupled plasma etch system uses an energized plasma to remove selected material from a wafer surface.
Where it fits in the process flow
General reference — not yet source-verifiedA plasma etch tool sits in the pattern-transfer portion of semiconductor fabrication after a masking or lithography step and before later cleaning and downstream integration steps.
Applications
What do the numbers mean?
Power & electrical4
- 50/60 Hz[1]
Vacuum & pumping3
- with Chillers, Transformer, Pumps[1]
Wafer handling1
Configuration & options5
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Configuration50/60 Hz[1]
- Source GeneratorENI MKS GMW25[1]
- Configurationwith Chillers, Transformer, Pumps[1]
- Electrical Input1 Phase, 3 Wire, 50/60 Hz, 208/230 Vac, 15 A[1]
- Included EquipmentChillers, Transformer, Pumps[1]
- Electrical Configuration1 Phase - 3 Wire - 50/60 Hz - 208/230 Vac - 15 A[1]
- Included ComponentsChillers, Transformer, Pumps[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What materials can be etched with an ICP etch system?General reference — not yet source-verified
ICP systems can etch a wide variety of materials used in semiconductor and MEMS fabrication, including silicon, silicon dioxide, silicon nitride, aluminum, copper, titanium, tungsten, and III-V compounds such as gallium arsenide or indium phosphide. The process chemistry (gases and parameters) is tailored to the material being etched.
How does ICP etching achieve high aspect ratios?General reference — not yet source-verified
High aspect ratios are achieved by using a combination of optimized gas chemistry, low pressure to reduce lateral etching, and a switched or pulsed process (e.g., Bosch process for deep silicon etching) that alternates between etching and passivation steps. The independent control of ion energy and density helps maintain directionality and protects sidewalls.
What is the role of substrate RF bias in ICP etching?General reference — not yet source-verified
The substrate RF bias controls the energy of ions bombarding the wafer surface. By adjusting this bias, the operator can influence the etch rate, anisotropy (directionality), and selectivity. Higher bias increases physical sputtering, which can improve profile control but may also reduce selectivity and increase damage.
What are common maintenance concerns for ICP etch systems?General reference — not yet source-verified
Common concerns include maintaining a clean plasma chamber to avoid particle contamination and process drift, monitoring coil integrity and RF matching networks, and ensuring proper gas delivery and exhaust systems. Regular cleaning and calibration are needed to sustain reproducible etch performance.
Not publicly documented
The following facts about the Versaline VCX 600 ICP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Versaline VCX 600 ICP are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Versaline VCX 600 ICP are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Versaline VCX 600 ICP are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Versaline VCX 600 ICP are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Versaline VCX 600 ICP is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
Last updated Oct 11, 2026.
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