Oxford Instruments
plasmapro-ngp80-rie
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The PlasmaPro NGP80 RIE is a reactive ion etching system from Oxford Instruments. The PlasmaPro NGP80 RIE is used for reactive ion etching processes, such as etching SiO2 hard masks with CHF3/Ar plasma. The PlasmaPro NGP80 RIE is used at a temperature of 20°C for etching processes.[1][2]
How it works
What do the numbers mean?
Gas & chemistry2
Optics & imaging2
Configuration & options6
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of materials can be etched with this class of RIE system?General reference — not yet source-verified
RIE systems can etch a wide range of thin films including dielectrics like silicon dioxide and silicon nitride, semiconductors such as silicon and gallium arsenide, and metals like aluminum and titanium. The specific chemistry and process conditions must be tuned for each material to achieve acceptable etch rates and selectivity.
How is the etch rate and uniformity controlled in such systems?General reference — not yet source-verified
Etch rate and uniformity are controlled by adjusting RF power, chamber pressure, gas flow rates, and electrode temperature. Uniformity can be optimized through careful chamber design, gas distribution, and temperature control. End-point detection and in-situ monitoring help maintain consistency across the wafer.
What maintenance or safety considerations apply to RIE equipment?General reference — not yet source-verified
RIE systems require periodic cleaning of the chamber to remove deposited byproducts, as well as inspection and replacement of consumable parts like O-rings and electrodes. Safety considerations include handling of toxic or corrosive process gases, high-voltage RF systems, and vacuum interlocks. Proper training and adherence to protocols are essential.
Not publicly documented
The following facts about the plasmapro-ngp80-rie are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the plasmapro-ngp80-rie are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the plasmapro-ngp80-rie are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the plasmapro-ngp80-rie are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the plasmapro-ngp80-rie are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the plasmapro-ngp80-rie is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]discovery.ucl.ac.uk — discovery.ucl.ac.ukdiscovery.ucl.ac.uk
- [2]eprints.gla.ac.uk — eprints.gla.ac.ukeprints.gla.ac.uk
- [3]confluence.nanofab.ualberta.ca — confluence.nanofab.ualberta.caconfluence.nanofab.ualberta.ca
Last updated Oct 3, 2026.
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