OAI
806
The OAI 806 Mask Aligner is a UV photolithography tool that patterns substrates up to 6 inches. The OAI 806 supports soft, hard, and proximity contact modes with submicron alignment accuracy. The OAI 806 is designed for research and prototyping of semiconductors, MEMS, and photonic devices.[1]
What it is
The OAI 806 is a mask aligner used for photolithography. The OAI 806 handles substrates up to 6 inches and supports soft contact, hard contact, and proximity contact modes.[1]
How it works
The OAI 806 uses a collimated UV light source to expose photoresist. The OAI 806 uses integrated microscope optics and a motorized stage for alignment before exposure.[1]
The OAI 806 includes a vacuum chuck and optional backside alignment. The OAI 806 is intended to support consistent exposures for single-layer and multi-layer patterning.[1]
Where it fits in the process flow
The OAI 806 is used for research and prototyping. The OAI 806 supports patterning workflows that require alignment between repeated exposure steps.[1]
Applications
The OAI 806 is used for fabricating semiconductors, MEMS, and photonic devices. The OAI 806 is suited to advanced microfabrication tasks that rely on UV lithography.[1]
- photolithography
- research and prototyping
- fabricating semiconductors
- MEMS
- photonic devices
What do the numbers mean?
Vacuum & pumping1
Wafer handling2
Optics & imaging2
Performance3
Configuration & options5
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Workholdingvacuum chuck[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What substrate size does the OAI 806 support?
The OAI 806 supports substrates up to 6 inches.[1]
Which exposure modes does the OAI 806 support?
The OAI 806 supports soft contact, hard contact, and proximity contact modes.[1]
Does the OAI 806 support backside alignment?
The OAI 806 supports optional backside alignment.[1]
What optical source does the OAI 806 use?
The OAI 806 uses a collimated UV light source.[1]
What kinds of devices is the OAI 806 used to fabricate?
The OAI 806 is used for semiconductors, MEMS, and photonic devices.[1]
Not publicly documented
The following facts about the 806 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 806 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 806 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 806 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 806 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 806 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]colorado.edu — colorado.educolorado.edu
- [2]Resource Scheduler & Rates | Colorado Shared Instrumentation in Nanofabrication and Characterization (COSINC) | University of Colorado Boulder — colorado.educolorado.edu
- [3]Resource Scheduler & Rates | Colorado Shared Instrumentation in Nanofabrication and Characterization (COSINC) | University of Colorado Boulder — colorado.educolorado.edu
Last updated Oct 3, 2026.
Compare with similar tools
View all →
The CEE 100 is a lithography spin coater/developer tool that accepts up to 6-inch wafers and supports programmable multi-step processing.
Heidelberg Instruments DWL66 is a high-resolution direct write pattern generator for direct writing on various substrates and mask making.
Raith EBPG5200 is a direct write electron beam lithography system with high-kV capability and automation features stated in the product page for the EBPG line.
