Kulicke & Soffa
4124 Ball
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Kulicke & Soffa 4124 Ball is a ball wire bonder. The Kulicke & Soffa 4124 Ball is used to form conductive leads between a device and a substrate or package. The Kulicke & Soffa 4124 Ball supports gold wire ball bonding with semi-automatic and manual operation modes.[1][2][3]
How it works
The bonding cycle is controlled by a chessman positioning system and a set of parameter knobs. In operation, the gold wire is threaded through a ceramic capillary. To initiate the first bond, the capillary descends to a search height above the bond site, the operator fine-positions using the chessman, and then releases the bond button. The capillary applies a downward force, and a 60 kHz ultrasonic transducer delivers energy to bond the wire. A high-voltage spark from the EFO wand forms a ball at the wire tip before bonding. After the first bond, the wire is fed a set loop length, and the second bond is made as a wedge bond at a second location. Parameters including search height, force, ultrasonic power, time, and loop length are individually adjustable for each bond phase.[1][2][3]
Why won't it start?
Documented failure modes, common issues, and field considerations.
- High voltage is present during EFO spark generation.
- Touching the EFO wand during spark generation can cause electric shock.
- The bonding process uses heat, ultrasonic energy, physical force, and time.
- Some MEMS devices cannot be bonded because ultrasonic energy can destroy them.
What do the numbers mean?
Power & electrical1
Control & software1
Dimensions & facilities2
Configuration & options23
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Ultrasonic systemHigh Q 60 kHz transducer; PLL ultrasonic generator[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What range of wire diameters can be used with the 4124?
The bonder can accommodate gold wire with diameters from 17.5 µm to 75 µm.[2]
What is the bonding area of the 4124?
The bonding area is 152 x 152 mm (6 x 6 inches).[2]
What modes of operation does the 4124 offer?
The bonder supports semi-automatic mode and manual Z operation.[2]
How much bond force can the machine apply?
The bond force is adjustable from 10 to 160 g using a force coil.[2]
Not publicly documented
The following facts about the 4124 Ball are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 4124 Ball are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 4124 Ball are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 4124 Ball are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the 4124 Ball is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 4124 Ball are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]nrf.aux.eng.ufl.edu — nrf.aux.eng.ufl.edunrf.aux.eng.ufl.edu
- [2]assetrelay.com — assetrelay.comassetrelay.com
- [3]clara.nz — clara.nzclara.nz
- [4]Equipment inventory listing
Last updated Sep 29, 2026.
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