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0041-26723 Bonded Assemblyversus4124 Ball

Applied Materials 0041-26723 Bonded Assembly, Kulicke & Soffa 4124 Ball, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
4124 BallKulicke & Soffa
OEMApplied MaterialsKulicke & Soffa
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyKulicke & Soffa 4124 Ball
Specifications
Manufacturer—Kulicke & Soffa[1]
Model—4124 Ball[1]
Equipment type—Ball Wire Bonder[1]
Bond wire material—Gold wire[2]
Bonding mode—Semi-auto, Manual[2]
Bonding area—152 x 152 mm (6 x 6 inch)[2]
Throat depth—143 mm (5.6 inch)[2]
Gross table motion—140 mm (5.5 inch)[2]
Fine table motion—14 mm (0.55 inch)[2]
Mouse ratio—6:1[2]
Z-motion system—DC servo/LVDT control[2]
Z travel—9.1 mm[2]
Ultrasonic system—High Q 60 kHz transducer; PLL ultrasonic generator[2]
Low ultrasonic power—1.3 W[2]
High ultrasonic power—2.5 W[2]
Bond time—10-100 msec / 10-1000 msec[2]
Single Point TAB—Available[2]
Bond force—Force coil 10-160 g[2]
Wire diameter—17.5 µ to 75 µ[2]
Spool size—2"[2]
Maximum work-piece size—About 3 inches square[3]
Search position height—75-125 um above the bond site level[4]
Wire Material—Gold[2]
Wire Diameter Range—17.5 to 75 µm[2]
Spool Size—2 inch[2]
Modes of Operation—Semi-auto, Manual Z[2]
Deep Access Option—0.0650" length Capillary[2]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]assetrelay.comassetrelay.com
  3. [3]nrf.aux.eng.ufl.edunrf.aux.eng.ufl.edu
  4. [4]clara.nzclara.nz