Hitachi
HS 9050
The Hitachi HS 9050 is a 12-inch asher. The Hitachi HS 9050 is a multi-chamber tool with five ashing units. The Hitachi HS 9050 includes a Mini-Environment Wafer Loading Module (EFEM).[1][2]
Wafer size
Mini-Environment Wafer Loading Module (EFEM)
Power
AXG-5000Ⅲ-27M-KE[1]
Vacuum
Dual-Arm High Speed Vacuum Robot Assembly[1]
Performance
V-notch alignment and centering[1]
Gas delivery
N2 Max Flow 20 L/min[1]
What it is
General reference — not yet source-verifiedThe Hitachi HS 9050 is a semiconductor resist-processing system.
How it works
General reference — not yet source-verifiedA resist-processing tool in this class removes or modifies photoresist or other organic films by exposing the wafer to a controlled plasma or reactive-gas process in one or more chambers. The machine uses vacuum conditions, gas delivery, and RF power to create the process environment, while wafer handling hardware moves substrates between load ports, buffers, and process modules.
Where it fits in the process flow
General reference — not yet source-verifiedResist-processing tools sit after lithography and before downstream etch, strip, clean, or inspection steps in a wafer process flow.
Applications
General reference — not yet source-verifiedTools in this class are used for photoresist stripping, ash removal, residue reduction, and plasma-based surface preparation on semiconductor wafers.
Why won't it start?
Documented failure modes, common issues, and field considerations.
- HDD removed
- No software or hard drives
What do the numbers mean?
Power & electrical1
Vacuum & pumping2
Wafer handling8
Gas & chemistry11
Optics & imaging1
Performance1
Control & software3
Configuration & options18
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ConfigurationDual-Arm High Speed Vacuum Robot Assembly[1]
- ConfigurationPart number of pads for Vacuum Robot[1]
- RF power supplyAXG-5000Ⅲ-27M-KE[1]
- MFC #NN2 Max Flow 20 L/min[1]
- MFC #1O2 Max Flow 20 L/min[1]
- MFC #2Ar Max Flow 20 L/min[1]
- MFC #3H2 Max Flow 5 L/min[1]
- MFC #4N2 Max Flow 20 L/min[1]
- MFC #5CF4 Max Flow 1 L/min[1]
- MFC #6CO2 Max Flow 0.4 L/min[1]
- MFC #7He Max Flow 20 L/min[1]
- MFC #8Without gasline, without MFC[1]
- MFC #9Without gasline, without MFC[1]
- MFC #10Without gasline, without MFC[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the HS 9050 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the HS 9050 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the HS 9050 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the HS 9050 are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the HS 9050 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the HS 9050 are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Hitachi Hitachi Hs 9050 Etching System — Precision Dry Etching Equipment (Hitachi) — Used & Refurbished | Caladan — caladansemi.comcaladansemi.com
Last updated Oct 6, 2026.
Compare with similar tools
View all →
Headway 1 EC 101 R 485 is a photoresist spinner with stated vacuum and electrical requirements.
The CEE 100 is a spin coater with a listed power specification of 115 volts and 800 watts.
The EV Group 120 Automated Coater Processing System is an automated coater for 6-inch and 8-inch wafers, built in 2015 and requiring 50/60 Hz, 3-phase, 4-wire plus ground power.
