Electroglas
EG4
Plate 01#EG4 FlexBOSS21 used for off-the-grid or whole-home backup #solar #solarbattery
Solar SurgeWatch on YouTubePlate 02EG4's 3000EHV has some SERIOUS surge capacity
Current ConnectedWatch on YouTubePlate 03Eg4 12000XP vs Solis S6 11.4 kW Sine Wave Fail! Tektronix Scope tells the truth!
Ed's DIY Solar FarmingWatch on YouTubePlate 04EG4 FlexBoss LCD Nightmare: Where's the Manual?!
Rocky Broad SolarWatch on YouTubePlate 05EG4 GridBoss is the ideal central connection for all things #solar #solarbattery #batterystorage
Solar SurgeWatch on YouTubePlate 06DETAILED How I Wired My EG4 12000XP House Inverter Start to Finish!
Todd ElfersWatch on YouTube
What it is
How it works
The high-force Z-drive of the EG4|200 is intended to deliver contact force up to 150 kilograms, supporting bumped wafers and multi-die application requirements.[1]
Where it fits in the process flow
General reference — not yet source-verifiedWafer probing is performed after wafer fabrication is complete and before the wafer is diced into individual chips; it is also known as wafer sort or electrical die sort.
Applications
The EG4|200 is designed for multi-die and bumped 200 mm wafer applications, and is aimed at complex system-on-chip and high-parallel memory devices.[1]
The EG4|200e is intended for ultra-low noise testing such as parametric test, e-test, and wafer acceptance.[1]
- leading-edge 200mm wafer applications
- multi-die 200mm wafer applications
- bumped 200mm wafer applications
- parametric test
- e-test
- wafer acceptance
What do the numbers mean?
Wafer handling2
Dimensions & facilities1
Configuration & options3
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| EG4|200e | — | — | Described as an ultra-low-noise wafer prober for parametric test, e-test, and wafer acceptance. | web.archive.org[2] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the primary purpose of a wafer prober?General reference — not yet source-verified
A wafer prober's primary purpose is to make temporary electrical contact with each die on a semiconductor wafer so that a test system can determine whether the die is functional, measure its performance, and sort or map the results before the wafer is diced.
How does a wafer prober maintain accurate alignment during testing?General reference — not yet source-verified
Wafer probers use an optical alignment system (often a microscope and camera) to locate alignment marks on the wafer. The machine then calibrates the wafer stage position relative to the probe card, compensating for tilt, rotation, and thermal expansion. Closed-loop feedback from the motion system ensures precise stepping between die.
What types of probe cards are commonly used with wafer probers?General reference — not yet source-verified
Common probe card types include cantilever needle cards (for low-pin-count applications), vertical (or 'straight') needle cards (for higher density), and membrane probe cards (for high-speed or fine-pitch testing). The choice depends on the device pad pitch, signal integrity requirements, and test environment.
How does the prober handle wafers during loading and unloading?General reference — not yet source-verified
Wafer probers typically include automated wafer handling systems that retrieve wafers from a cassette or front-opening unified pod (FOUP), transport them to a pre-alignment station, and then place them on the chuck. After testing, the wafer is returned to the cassette. The handling system minimizes contamination and damage.
What environmental controls are important for accurate probing?General reference — not yet source-verified
Accurate probing requires a controlled environment: temperature stability to prevent thermal drift of the wafer and probe card, vibration isolation to maintain contact during measurements, and often a dry or inert atmosphere to prevent oxidation or corrosion of probe tips and bond pads. Some probers include active temperature control of the chuck.
Not publicly documented
The following facts about the EG4 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the EG4 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the EG4 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the EG4 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the EG4 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the EG4 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]web.archive.org — web.archive.orgweb.archive.org
- [3]web.archive.org — web.archive.orgweb.archive.org
Last updated Oct 4, 2026.
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