Waferpedia

Applied Materials

9500 Ion

The Applied Materials 9500 Ion Implanter is a semiconductor ion implantation tool designed for 6-inch wafers. The 9500 Ion Implanter features a Bernas ion source and a variable tilt angle of 0-7 degrees. The 9500 Ion Implanter includes a wafer orientor and SECS/GEM interface.[1][2]

9500 Ion — Inventory photo
Fig. 019500 IonInventory photo[1]

Wafer size

Wafer orientor

Power

60 Hz[1]

Vacuum

Seiko Seiki[1]

Gas delivery

Boron[1]

How it works

The 9500 uses a Bernas-type ion source. The extraction system is a single bellows design. The implanter supports a variable tilt angle from zero to seven degrees. The beamline is of standard configuration. A plasma flood system (HDPFS) is present for charge neutralization. The machine includes a wafer orientor and a factory interface supporting SECS/GEM protocol.[1][2]

What do the numbers mean?

Power & electrical4

Frequency
60 Hz[1]
Accurate?
Line Frequency
60 Hz[2]
Accurate?
Line Frequency (Source 2)
60 Hz[2]
Accurate?
Hydrogen Generator
No[2]
Accurate?

Vacuum & pumping10

Turbo pumps type
Seiko Seiki[1]
Accurate?
Mech pumps type
Edwards[1]
Accurate?
Cryo pumps type
Cryotorr[1]
Accurate?
Turbo Pump Type
Seiko Seiki[1]
Accurate?
Mech Pump Type
Edwards[1]
Accurate?
Cryo Pump Type
Cryotorr[1]
Accurate?
Turbo Pump Type (Source 2)
Leybold[2]
Accurate?
Mech Pump Type (Source 2)
Edwards[2]
Accurate?
Cryo Pump Type (Source 2)
CTI Helix Onboard[2]
Accurate?
Auto Cryo Purge
No[2]
Accurate?

Wafer handling11

Wafer cassette
25 wafers[1]
Accurate?
Wafer size
Wafer orientor[1]
Accurate?
Wafer Fittings
Imperial[2]
Accurate?
Wafer Size
6 inch[1]
Accurate?
Wafer Cassette Capacity
25 wafers[1]
Accurate?
Wafer Orientor
Yes[1]
Accurate?
Wafer Size (Source 2)
6 inch[2]
Accurate?
Wafer Cassette Capacity (Source 2)
25 wafers[2]
Accurate?
Wafer Orienter (Source 2)
Yes[2]
Accurate?
Wafer Size (Source 3)
200mm[3]
Accurate?
Wafer size
200 mm[3]
Accurate?

Gas & chemistry10

Gas Position 1
Boron[1]
Accurate?
Gas Position 2
N/A[1]
Accurate?
Gas Position 3
Available SDS[1]
Accurate?
Gas Position 4
Arsine[1]
Accurate?
Gas Position 1 (Source 2)
N/A[2]
Accurate?
Gas Position 2 (Source 2)
N/A[2]
Accurate?
Gas Position 3 (Source 2)
Phosphine[2]
Accurate?
Gas Position 4 (Source 2)
Arsine[2]
Accurate?
Toxic Gas Alarm
No[2]
Accurate?
Gas position 4 (Arsine)
Arsine[1]
Accurate?

Control & software1

Factory interface
SECS/GEM[1]
Accurate?

Configuration & options40

Water fittings
Imperial[1]
Accurate?
Remote distance
~6m umbilical[1]
Accurate?
Layout
Thru wall[1]
Accurate?
Second compressor
9600 (qty 2)[1]
Accurate?
Helium line length
15 m[1]
Accurate?
RGA[1]
Accurate?
Tilt angle
Variable 0-7[1]
Accurate?
Wheel type
Standard[1]
Accurate?
Beamstop
Enlarged Beam Stop[1]
Accurate?
Plasma Flood System
HDPFS[1]
Accurate?
Beamline
Standard[1]
Accurate?
Source type
Bernas[1]
Accurate?
Front plate
Tungsten[1]
Accurate?
Utilities
Top[2]
Accurate?
Remote Distance
6 m umbilical[2]
Accurate?
Tilt Angle
Variable 0-7 degrees[1]
Accurate?
Front Plate Material
Tungsten[1]
Accurate?
Extraction Type
Single bellows[1]
Accurate?
TEM
No[1]
Accurate?
Source Chamber Liners
Yes[1]
Accurate?
MRS Chamber Liners
Yes[1]
Accurate?
TFT Monitor Upgrade
Yes[1]
Accurate?
RGA
Yes[1]
Accurate?
Tilt Angle (Source 2)
Variable 0-7 degrees[2]
Accurate?
Wheel Type (Source 2)
Standard[2]
Accurate?
Source Type (Source 2)
Bernas[2]
Accurate?
Front Plate Material (Source 2)
Tungsten[2]
Accurate?
Extraction Type (Source 2)
Single Bellows[2]
Accurate?
Source Chamber Liners (Source 2)
Yes[2]
Accurate?
MRS Chamber Liners (Source 2)
Yes[2]
Accurate?
TFT Monitor Upgrade (Source 2)
Yes[2]
Accurate?
RGA (Source 2)
No[2]
Accurate?
Remote Distance (Source 2)
6 m umbilical[2]
Accurate?
Layout (Source 2)
Through wall[2]
Accurate?
Second Compressor (Source 2)
Yes 9600 (2)[2]
Accurate?
Helium Line Length (Source 2)
15 m[2]
Accurate?
Vaporizers
No[2]
Accurate?
VESDA
No[2]
Accurate?
Description (Source 3)
Ion Implanter (High Current)[3]
Accurate?
Implanter type
High Current[3]
Accurate?

Vintage & configurations

  1. 1993-06-01Vintage[3]

    Manufacture date for a specific unit (PI-9500 variant)

Documented models & variants

DesignationGenerationVintageChangesSource
PI-9500———fabsurplus.com[3]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Frequency60 Hz[1]
  • Turbo pumps typeSeiko Seiki[1]
  • Mech pumps typeEdwards[1]
  • Cryo pumps typeCryotorr[1]
  • Line Frequency60 Hz[2]
  • Gas Position 1Boron[1]
  • Gas Position 2N/A[1]
  • Gas Position 3Available SDS[1]
  • Gas Position 4Arsine[1]
  • Turbo Pump TypeSeiko Seiki[1]
  • Mech Pump TypeEdwards[1]
  • Cryo Pump TypeCryotorr[1]
  • Gas Position 1 (Source 2)N/A[2]
  • Gas Position 2 (Source 2)N/A[2]
  • Gas Position 3 (Source 2)Phosphine[2]
  • Gas Position 4 (Source 2)Arsine[2]
  • Line Frequency (Source 2)60 Hz[2]
  • Turbo Pump Type (Source 2)Leybold[2]
  • Mech Pump Type (Source 2)Edwards[2]
  • Cryo Pump Type (Source 2)CTI Helix Onboard[2]
  • Hydrogen GeneratorNo[2]
  • Toxic Gas AlarmNo[2]
  • Auto Cryo PurgeNo[2]
  • Gas position 4 (Arsine)Arsine[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What kind of dopant species can this class of machine handle?General reference — not yet source-verified

High-current ion implanters are typically designed to handle common dopants such as boron, phosphorus, and arsenic. The specific species are selected based on the desired conductivity type and process requirements.

What is the typical throughput of such systems?General reference — not yet source-verified

Throughput varies by process conditions and wafer size, but high-current implanters are engineered for high productivity, often processing hundreds of wafers per hour for low-dose applications, though high-dose implants may reduce throughput.

What are the key maintenance considerations for ion implanters?General reference — not yet source-verified

Regular maintenance includes cleaning of the ion source, replacement of consumable parts (e.g., filaments), and periodic calibration of the beam and dose measurement systems to ensure process stability and uniformity.

How does this class of machine ensure uniform implantation across the wafer?General reference — not yet source-verified

Uniformity is achieved through precise scanning mechanisms—either moving the wafer through the beam or sweeping the beam over a stationary wafer—combined with real-time dose and angle monitoring to correct any non-uniformities.

Not publicly documented

The following facts about the 9500 Ion are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • The control-system platform and OS era of the 9500 Ion are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 9500 Ion are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 9500 Ion is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 9500 Ion are on record.

    Answerable by: an OEM parts catalog or a service engineer

  • No publicly hosted manuals, SOPs, or datasheets for the 9500 Ion are on record.

    Answerable by: university cleanroom staff or an OEM application specialist

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]inventory listing
  3. [3]fabsurplus.com — fabsurplus.comfabsurplus.com
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Last updated Sep 30, 2026.

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