Comparison ledger
Applied Materials 0010 47763, Lam Research Rainbow 4520, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010 47763Applied Materials | Rainbow 4520Lam Research |
|---|---|---|
| OEM | Applied Materials | Lam Research |
| Category | Etch | Etch |
| Wafer size | — | 8" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010 47763 | Lam Research Rainbow 4520 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | 2nd Source New[2] | — |
| Type | Monopolar Dual Heated[3] | Plasma/RIE etching system[1] |
| Description | ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[4] | — |
| Possible Materials | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[3] | — |
| Model | 0010-47763[2] | Lam Rainbow 4520[1] |
| OEM | Applied Materials[2] | Lam Research[1] |
| Material (possible) | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[3] | — |
| Application | Fixing wafers in etching process (PVD, CVD, ETCH)[3] | — |
| Quantity available (source) | 1[3] | — |
| Condition | — | Refurbished and Upgraded[1] |
| Chuck type | — | Clamp; customized[1] |
| Wafer size | — | Up to 8 inch capability; customized[1] |
| Controller | — | Allwin21 PC with touch screen monitor[1] |
| Operation modes | — | Maintenance, Manual, Semi Automatic and Full Automatic[1] |
| Wafer handling | — | Fully automated, in-line, single-wafer plasma/RIE etching system[1] |
| Gases | — | 1-6 or 1-8 lines with MFC; maximum 9 lines[1] |
| Endpoint | — | Dual endpoint 405nm/520nm; EOP optional[1] |
| Automation | — | Fully automated, in-line, single-wafer[1] |
| Wafer Sizes | — | 6-inch or 8-inch[1] |
| Electrode | — | Top or/and bottom powered electrode plate[1] |
| Electrode Spacing | — | Programmable[1] |
| Wafer Alignment | — | Automatic noncontact wafer alignment and placement[1] |
| RF Match | — | Unique RF match networks located at upper and lower electrodes for programmable switching between plasma and RIE modes[1] |
| Main Use | — | Oxide Etch (Lam Rainbow 45XX Series)[1] |
| Control | — | Computer-controlled, manual or automatic control[1] |
| Chamber Type | — | Main chamber, moving gap standard process kit[1] |
| Chuck Type | — | Clamp chuck; ESC chuck optional[1] |
| Number of Gases | — | 1-6 or 1-8 lines MFC, maximum 9 lines[1] |
| Typical Gases | — | Ar, CF4, CHF3, He, SF6, N2, NF3 (process dependent)[1] |
| Endpoint Detection | — | Dual endpoint 405nm/520nm EOP is optional[1] |
| Chiller | — | TCU LAM2080 Chiller module or equivalent is optional[1] |
| Base Pressure | — | ≤ 5 mT[1] |
| Chamber Leak Rate | — | ≤ 5 mT/min[1] |
| ELL & XLL Leak Rate | — | ≤ 10 mT/min[1] |
| Gap Set Point | — | 1 cm, tolerance ≤ 0.02 cm[1] |
| Chiller Precision | — | ± 1 ℃[1] |
| MFC/RF/DC Precision | — | ≤5% of set points[1] |
| Particle (Bare-Si, RF-Off) | — | < 50 @0.3um[1] |
| Power | — | 208V, 50/60Hz, 3 phase, 5 wires, WYE, 30A(Max), 23(Norm) for Etcher[1] |
| Physical Dimensions (Etcher) | — | 44"W x 54"D x 66"H, 1700 lbs[1] |
| Physical Dimensions (RF Cart) | — | 22"W x 32"D x 44"H, 250 lbs[1] |
| Physical Dimensions (TCU) | — | 23"W x 37"D x 55"H, 420 lbs[1] |
| Exhaust | — | Etcher Cabinet: Draw CFM 300, H2O 0.5, House, 4 inch Duct; Etcher Gas Panel: Draw CFM 75, H2O 0.5, Scrubbed, possible hazard, 2 inch Duct[1] |
| Cooling Water | — | R.F. Cart: 2±0.2 GPM, 85±5 PSI, 14~35°C, 3/8" ID fittings, <200 u; TCU: 6±0.5 GPM, 11~26°C, 1/2" ID fittings, <200 u[1] |
| Nitrogen | — | 40±10 PSI and 90±10 PSI, CDA can also be used for R.F. Cart[1] |
| Thermal Output | — | Etcher: 3.4K carried by water, 3.4k by exhaust, 7k dispersed; RF Cart: 7K carried by water, 7k dispersed; TCU: 4K carried by water, 1k dispersed[1] |
| Process Gases | — | 1/4" VCR fittings, <0.05u filter[1] |
Plan your fab
Building a Etch process? Get a complete equipment list.
Open the fab equipment planner →