Comparison ledger
Angstrom Engineering NexDep, Applied Materials 0010-13622 RF Match for, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | NexDepAngstrom Engineering | 0010-13622 RF Match forApplied Materials |
|---|---|---|
| OEM | Angstrom Engineering | Applied Materials |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Angstrom Engineering NexDep | Applied Materials 0010-13622 RF Match for |
| Cited variants | — | |
| Specifications | ||
| E-Beam pocket configuration | 6 x 7 cc multi-pocket E-Beam[1] | — |
| Chamber dimensions | 16" x 16" x 28"[1] | — |
| Chamber type | High aluminum high vacuum box chamber[1] | — |
| Base pressure | < 5 x 10^-7 Torr in a clean system[1] | — |
| Power supply | 3 kW[1] | — |
| Evaporation sources | Dual resistive evaporation sources[1] | — |
| Control | PC control station with fully automated sequences and software for deposition control[1] | — |
| Deposition modes | Combined co-deposition processing with e-beam and thermal or thermal and thermal processing; not e-beam and e-beam processing[1] | — |
| Multi-layer control | Multi-layer deposition control[1] | — |
| Category | Thermal E-Beam Evaporator (PVD)[1] | — |
| E-Beam Multi-Pocket | 6 x 7 cc[1] | — |
| Chamber Dimensions | 16" x 16" x 28" (high aluminum high vacuum box chamber)[1] | — |
| Base Pressure (clean system) | < 5 x 10-7 Torr[1] | — |
| Debris Shields | One set removable stainless steel debris shields[1] | — |
| Chamber Door | Hinged chamber front door for easy internal access[1] | — |
| Viewport | Large viewport offset to reduce material deposition[1] | — |
| Vacuum Chamber Material | High aluminum[1] | — |
| Ion Assisted Deposition (Nexdep 2 only) | Supported[1] | — |
| Configuration | — | High Efficiency HE RF Match-Bias[2] |
| Model | — | 0010-13622[2] |
| Product Type | — | RF Match for PVD (Physical Vapor Deposition)[2] |
| Feature | — | High Efficiency HE RF Match-Bias[2] |
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