Angstrom Engineering
NexDep
The Angstrom Nexdep Thermal E-Beam Evaporator is a PVD tool that offers E-Beam and Thermal evaporation for a variety of high melting point substrates. The Nexdep I is configured for Ti, SiO2, Cr, Au, Pt, and Ag. The Nexdep 1 can do principal E-Beam and thermal evaporation, while the Nexdep 2 can do principal E-Beam, thermal evaporation, and ion assisted deposition.[1]
Plate 01The Angstrom Engineering Nexdep Electron Beam Evaporation System
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What it is
The Angstrom Engineering Nexdep is a PVD tool that offers E-Beam and Thermal evaporation. The system is available as Nexdep 1 for principal E-Beam and thermal evaporation, and as Nexdep 2 which adds ion assisted deposition. The chamber is a 16 by 16 by 28 inch high aluminum high vacuum box chamber with a base pressure below 5 x 10⁻⁷ Torr in a clean system. The tool includes a 6 x 7 cc multi-pocket E-Beam source, a 3 kW power supply, and dual resistive evaporation sources. Additional features include a sweep controller, a hinged front door, removable stainless steel debris shields, and a large viewport offset to reduce material deposition.[1]
How it works
The Nexdep system includes a PC control station with fully automated sequences for deposition control. The tool supports combined co-deposition using e-beam and thermal or thermal and thermal sources, but not simultaneous e-beam and e-beam processing. Multi-layer deposition control is available.[1]
Where it fits in the process flow
General reference — not yet source-verifiedPhysical vapor deposition systems are used in semiconductor and thin-film fabrication to deposit metal, dielectric, and other functional layers. The deposition step typically follows substrate cleaning and precedes patterning or further processing.
Applications
The Angstrom Engineering Nexdep is used for electronic and optical semiconductor films, wear resistant and thermal barrier coatings, and hard coatings for tools. The Nexdep I configuration is configured for titanium, silicon dioxide, chromium, gold, platinum, and silver.[1]
- Electronic and optical semiconductor films
- Wear resistant and thermal barrier coatings
- Hard coatings for tools
What do the numbers mean?
Power & electrical1
Vacuum & pumping5
Control & software2
- Control
- PC control station with fully automated sequences and software for deposition control[1]
Dimensions & facilities1
Configuration & options9
- Deposition modes
- Combined co-deposition processing with e-beam and thermal or thermal and thermal processing; not e-beam and e-beam processing[1]
Vintage & configurations
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- Angstrom Rev-1.pdfDocumentumd.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What evaporation methods does the Nexdep support?
The Nexdep supports E-Beam and thermal evaporation. Nexdep 2 additionally supports ion assisted deposition.[1]
What is the base pressure of the Nexdep system?
The base pressure is less than 5 x 10⁻⁷ Torr in a clean system.[1]
What is the chamber size?
The chamber is a 16 by 16 by 28 inch high aluminum high vacuum box chamber.[1]
What is the power supply rating?
The system uses a 3 kW power supply.[1]
What are the key applications?
Key applications include electronic and optical semiconductor films, wear resistant and thermal barrier coatings, and hard coatings for tools.[1]
Not publicly documented
The following facts about the NexDep are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the NexDep are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the NexDep are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the NexDep are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the NexDep is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the NexDep are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]pnf.uchicago.edu — pnf.uchicago.edupnf.uchicago.edu
- [2]Evaporator: thermal [ANGSTROM-Thermal] | Quantum-Nano Fabrication and Characterization Facility | University of Waterloo — uwaterloo.cauwaterloo.ca
- [3]Angstrom Rev-1.pdf — nanocenter.umd.edunanocenter.umd.edu
Last updated Sep 21, 2026.
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