Comparison ledger
Tegal 1511e, Ulvac NE 950 EX ICP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1511eTegal | NE 950 EX ICPUlvac |
|---|---|---|
| OEM | Tegal | Ulvac |
| Category | Etch | Etch |
| Wafer size | three- to six-inch wafers | Wafer end effector |
| Process node | — | — |
| Introduced | 1984 | — |
| Production run | 1984– | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Tegal 1511e | Ulvac NE 950 |
| Specifications | ||
| tool type | tri-electrode dual-frequency plasma etch system[1] | — |
| wafer size | three- to six-inch wafers[1] | — |
| first sold | 1984[1] | — |
| system characteristic | first vacuum-loadlocked dual-frequency tri-electrode etch system[1] | — |
| First vacuum-loadlocked dual-frequency tri-electrode etch system | Yes[1] | — |
| Configuration | — | Toshiba FA2-100SS computer[2] |
| Wafer size | — | Wafer end effector[2] |
Plan your fab
Building a Etch process? Get a complete equipment list.
Open the fab equipment planner →