Comparison ledger
KLA 0035235-003 MMD Head, Toho Technology FLX-2320-S, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | FLX-2320-SToho Technology | |
|---|---|---|
| OEM | KLA | Toho Technology |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 0035235-003 MMD Head | Toho Technology FLX-2320-S |
| Specifications | ||
| Configuration | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Model | 0035235-003[1] | — |
| Make | KLA[1] | — |
| Part Description | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Compatible System | KLA AIT-XP[1] | — |
| Measurement principle | — | Measures the change in the radius of curvature of a wafer or substrate caused by deposition of a stressed thin film.[2] |
| Use case | — | Thin-film stress measurement.[2] |
| Function | — | Measures the change in the radius of curvature of a wafer or substrate caused by the deposition of a stressed thin film.[2] |
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