Comparison ledger
Hitachi 1305 BSG 3, Tokyo Electron Clean Track Mark 8, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1305 BSG 3Hitachi | Clean Track Mark 8Tokyo Electron |
|---|---|---|
| OEM | Hitachi | Tokyo Electron |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hitachi 1305 BSG 3 | Tokyo Electron Clean Track |
| Specifications | ||
| Configuration | — | 2C (1 ARC) / 2D (4 Cup Frame), 1 WEE[1] |
| WEE | — | Tel Standard[1] |
| PR Pump | — | 2-1 (3), 2-2[1] |
| Pump Type | — | 2-1; RRC, 2-2; RRC[1] |
| Type | — | Coater / Developer[1] |
| Wafer sizes supported | — | 8 inch[1] |
| Coat process - PR pump | — | 2-1 (3), 2-2[1] |
| Developer - Nozzle | — | 2-3; H Nozzle[1] |
| Resist processing (from journal) | — | Used for resist coating and development[2] |
| Wafer size | — | 8 inch[1] |
| Capability | — | Photoresist coating and developing, including HMDS treatment[2] |
| Vintage | — | 1998[1] |
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