Comparison ledger
Blanchard 20 36 Surface, Disco KR15, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 20 36 SurfaceBlanchard | KR15Disco |
|---|---|---|
| OEM | Blanchard | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | 8" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Blanchard 20 36 Surface | Disco KR15 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | With new Elecro-Matic Neutrol II Magnetic Chuck Control[2] | — |
| Magnetic Chuck Control | Electro-Matic Neutrol II[2] | — |
| Blade designation | — | Disco KR15[3] |
| Blade thickness | — | 200 micron[3] |
| Blade grit | — | low grit[3] |
| Intended materials | — | sapphire, glass, and silicon[3] |
| Max. workpiece size | — | Φ8"[3] |
| Thickness | — | 200 micron[3] |
| Grit | — | Low grit[3] |
| Materials | — | sapphire, glass, and silicon[3] |
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