Waferpedia

Comparison ledger

0010-21246 PartversusIPC 2000 / 3000

Applied Materials 0010-21246 Part, Branson IPC 2000 / 3000, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-21246 PartApplied Materials
OEMApplied MaterialsBranson
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Branson IPC 2000 / 3000
Specifications
Configuration—Refurbished[1]
Manufacturer—Branson[1]
Model—IPC 2000 / 3000[1]
Equipment family—Branson/IPC 2000, 3000, and 4000 Series manual plasma systems[2]
Loading—Manual load / unload[2]
Process type—Plasma ashing, descum, dry cleaning, surface treatment, or plasma etching depending on configuration[2]
Wafer / sample size—Small samples up to 8 inch wafers depending on model and chamber configuration[2]
Chamber type—Quartz chamber for ashing / descum or metal chamber for etching depending on model[2]
RF power—Configuration dependent[2]
Gas lines—Configuration dependent[2]
Wafer quantity per run—Configuration dependent[2]
Operation—Automatic, semi-automatic, or manual depending on controller configuration[2]
PC controller upgrade option—Available for selected working systems, subject to evaluation[2]
Model family—IPC 2000 / 3000 family[3]
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]waferpedia.comwaferpedia.com