West Bond
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The West Bond 7614A-32-45D is a wire bonder used in semiconductor packaging and bonding.[1]
A wire bonder positions a bonding tool over a die pad and a package pad or lead, then forms a bond at each end of the interconnect.
The class commonly supports wedge bonding and ball bonding, and some systems are configured for manual, semiautomatic, or automatic operation.
The West Bond 7614A-32-45D belongs in the back-end assembly flow after device fabrication and before final package completion.
The machine serves in die attachment and electrical interconnect formation for packaged semiconductor devices.
Wire bonding is used for connecting semiconductor dies to package leads, substrates, and other interconnect structures.
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The following facts about the 7614A-32-45D are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the 7614A-32-45D are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7614A-32-45D are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 7614A-32-45D are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 7614A-32-45D are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 7614A-32-45D are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Oct 3, 2026.
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