West Bond
747677E
The West Bond 747677E is a wire bonder. The West Bond 747677E is used for wire bonding to interconnect wire leads to semiconductor, hybrid, or microwave devices. The West Bond 747677E uses gold wire in a ball bonding configuration.[1][2]
Plate 01West Bond 747677E 79 Inv# 64,799
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What it is
The West Bond 747677E is a manual wire bonder used for interconnecting wire leads to semiconductor, hybrid, or microwave devices.[1][2]
The West Bond 747677E is a wire bonding tool for making electrical contacts between semiconductor dies and packages.[3]
How it works
Where it fits in the process flow
Applications
The West Bond 747677E is used for gold wire bonding of devices and packages.[2]
The West Bond 747677E is used for electrical contacts between semiconductor dies and packages.[3]
The West Bond 747677E is used with semiconductor, hybrid, and microwave devices.[1][2]
The West Bond 747677E supports wedge bonding and ball bonding methods.[3]
- Wire bonding to interconnect wire leads to semiconductor, hybrid, or microwave devices
- Gold wire bonding of devices and packages
- Making electrical contacts between semiconductor dies and packages
What do the numbers mean?
Power & electrical2
Configuration & options14
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of wire can this class of machine typically bond?General reference — not yet source-verified
Machines in this class are generally capable of bonding gold, copper, and aluminum wire, depending on the bonding method (e.g., gold ball bonding, copper ball bonding, or ultrasonic wedge bonding with aluminum wire). The specific wire diameter depends on the machine's tooling and application requirements.
What is the difference between ball bonding and wedge bonding?General reference — not yet source-verified
Ball bonding uses a capillary tool to form a spherical ball at the first bond, typically on the die pad, and is often done with gold or copper wire. Wedge bonding uses a wedge-shaped tool to apply ultrasonic energy and pressure, usually with aluminum wire, and does not require a ball formation. Both methods are common in this machine class, and the appropriate mode depends on the device and packaging requirements.
How is alignment and positioning achieved in this class of machine?General reference — not yet source-verified
Alignment is typically accomplished through pattern recognition (vision systems) that locate bond pads and lead positions. The machine uses motion stages—often with linear motors or precision screw drives—to position the bonding tool and workholder accurately. Closed-loop control ensures repeatable placement to within micron-level tolerances.
What maintenance is typically required for this type of equipment?General reference — not yet source-verified
Routine maintenance includes cleaning and replacing the bonding tool (capillary or wedge) as it wears, checking and tuning the ultrasonic transducer, ensuring wire feed and tension mechanisms are free of debris, and calibrating the vision system and motion stages. Periodic preventive maintenance schedules help maintain bond quality and machine uptime.
Not publicly documented
The following facts about the 747677E are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 747677E are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 747677E are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 747677E are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 747677E are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 747677E is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]smif.pratt.duke.edu — smif.pratt.duke.edusmif.pratt.duke.edu
- [2]smif.pratt.duke.edu — smif.pratt.duke.edusmif.pratt.duke.edu
- [3]uwaterloo.ca — uwaterloo.cauwaterloo.ca
Last updated Oct 3, 2026.
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