West Bond
The West Bond 7400A is a manual ultrasonic wedge wire bonder. The West Bond 7400A bonds fine wires in the range of 0.7 mil (18 microns) to 4 mil (100 microns) and larger with added features. The West Bond 7400A features an independent wire feed and work-sensing tool and a single-lever X-Y-Z manipulator.[1][2]
Plate 01West Bond 7400A-28-44A-45-46-66 Manual Bonder with Olympus SZ30 #60788
Plate 02West-Bond 7400A Wire Bonder Demonstration - Part 1
Plate 03West-Bond 7400A Wire Bonder Demonstration - Part 2
The West Bond 7400A is a wire bonder used in semiconductor and packaging work.
A wire bonder makes electrical interconnects by attaching fine wire between a device pad and a second connection point. A wedge bonder uses a wedge tool to form the bond interface and advance the wire along the programmed path.
Wire bonding sits near the back end of device assembly after the die or substrate has been prepared for interconnection. Wire bonding then creates the electrical links needed to connect the device to its package or to a circuit assembly.
The West Bond 7400A is used for fine-wire interconnection work in semiconductor assembly.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| West-Bond 7400A 90° Vertical Feed Deep Access Manual Wedge Wire Bonder | — | — | Manual wedge wire bonder with 90° vertical feed deep access configuration. | semistarcorp.com[3] |
| West-Bond 7400A Ultrasonic 45° Feed Wedge Wire Bonder | — | — | Ultrasonic wedge wire bonder with 45° feed configuration. | semistarcorp.com[3] |
| West-Bond 7400A Ultrasonic 60° Feed Wedge Wire Bonder | — | — | Ultrasonic wedge wire bonder with 60° feed configuration. | semistarcorp.com[3] |
| West-Bond 7400A Ultrasonic 90° Feed Deep Access Wedge Wire Bonder | — | — | Ultrasonic wedge wire bonder with 90° feed deep access configuration. | semistarcorp.com[3] |
| West-Bond 7400A-26-44B-45 | — | — | Includes Bausch & Lomb StereoZoom 4 microscope, 45° feed indicated by suffix -45 | ntc-tech.com[4] |
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The West Bond 7400A bonds fine wires in the range of 0.7 mil (18 microns) to 4 mil (100 microns).[1][2]
The 7400A does not require setting a search height because the work-sensing tool responds automatically to work elevation.[1][2]
Yes, configurations of the 7400A are available for deep access bonding, including models with 90-degree vertical feed deep access.[3]
The following facts about the 7400A are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7400A are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 7400A are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 7400A are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 7400A is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 7400A are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Last updated Oct 7, 2026.
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