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West Bond

7400A

Packaging & BondingWest Bond 7400A family
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The West Bond 7400A is a manual ultrasonic wedge wire bonder. The West Bond 7400A bonds fine wires in the range of 0.7 mil (18 microns) to 4 mil (100 microns) and larger with added features. The West Bond 7400A features an independent wire feed and work-sensing tool and a single-lever X-Y-Z manipulator.[1][2]

West Bond7400A
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  • Plate 01West Bond 7400A-28-44A-45-46-66 Manual Bonder with Olympus SZ30 #60788

    Bid ServicellcWatch on YouTube
  • Plate 02West-Bond 7400A Wire Bonder Demonstration - Part 1

    Gregory WrightWatch on YouTube
  • Plate 03West-Bond 7400A Wire Bonder Demonstration - Part 2

    Gregory WrightWatch on YouTube

What it is

General reference — not yet source-verified

The West Bond 7400A is a wire bonder used in semiconductor and packaging work.

How it works

General reference — not yet source-verified

A wire bonder makes electrical interconnects by attaching fine wire between a device pad and a second connection point. A wedge bonder uses a wedge tool to form the bond interface and advance the wire along the programmed path.

Where it fits in the process flow

General reference — not yet source-verified

Wire bonding sits near the back end of device assembly after the die or substrate has been prepared for interconnection. Wire bonding then creates the electrical links needed to connect the device to its package or to a circuit assembly.

Applications

General reference — not yet source-verified

The West Bond 7400A is used for fine-wire interconnection work in semiconductor assembly.

  • Wire bonding

What do the numbers mean?

Configuration & options10

Equipment type
Manual wedge wire bonder[3]
Accurate?
90° vertical feed deep access manual wedge wire bonder[3]
Accurate?
Ultrasonic 45° feed wedge wire bonder[3]
Accurate?
Ultrasonic 60° feed wedge wire bonder[3]
Accurate?
Ultrasonic 90° feed deep access wedge wire bonder[3]
Accurate?
Bonding Type
Ultrasonic wedge wire bonding[1]
Accurate?
Wire Diameter Range
0.7 mil (18 microns) to 4 mil (100 microns), and larger with added features[1]
Accurate?
Feed Angle Options
45°, 60°, 90°[3]
Accurate?
Manipulator Type
Single-lever X-Y-Z manipulator[1]
Accurate?
Wire Feed
Independent wire feed and work-sensing tool[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
West-Bond 7400A 90° Vertical Feed Deep Access Manual Wedge Wire Bonder——Manual wedge wire bonder with 90° vertical feed deep access configuration.semistarcorp.com[3]
West-Bond 7400A Ultrasonic 45° Feed Wedge Wire Bonder——Ultrasonic wedge wire bonder with 45° feed configuration.semistarcorp.com[3]
West-Bond 7400A Ultrasonic 60° Feed Wedge Wire Bonder——Ultrasonic wedge wire bonder with 60° feed configuration.semistarcorp.com[3]
West-Bond 7400A Ultrasonic 90° Feed Deep Access Wedge Wire Bonder——Ultrasonic wedge wire bonder with 90° feed deep access configuration.semistarcorp.com[3]
West-Bond 7400A-26-44B-45——Includes Bausch & Lomb StereoZoom 4 microscope, 45° feed indicated by suffix -45ntc-tech.com[4]
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What is the wire diameter range that the West Bond 7400A can bond?

The West Bond 7400A bonds fine wires in the range of 0.7 mil (18 microns) to 4 mil (100 microns).[1][2]

What type of bonding technology does the 7400A use?

The 7400A uses ultrasonic bonding technology.[1][2]

Does the 7400A require setting a search height?

The 7400A does not require setting a search height because the work-sensing tool responds automatically to work elevation.[1][2]

What type of manipulator does the 7400A use?

The 7400A uses a single-lever X-Y-Z manipulator.[1][2]

Is the 7400A suitable for deep access bonding?

Yes, configurations of the 7400A are available for deep access bonding, including models with 90-degree vertical feed deep access.[3]

Not publicly documented

The following facts about the 7400A are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7400A are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the 7400A are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 7400A are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 7400A is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 7400A are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]jmind.com — jmind.comjmind.com
  2. [2]Westbond 7400A Ultrasonic wire bonder — wotol.comwotol.com
  3. [3]semistarcorp.com — semistarcorp.comsemistarcorp.com
  4. [4]ntc-tech.com — ntc-tech.comntc-tech.com
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Last updated Oct 7, 2026.

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