Varian

EHPI 500

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The Varian EHPI 500 is a medium current ion implanter. The EHPI-500 offers an energy range up to 780 keV. The EHPi-500 supports wafer sizes up to 200 mm.^[1]^[2]

EHPI 500 — Inventory photo — Fig. 01EHPI 500Inventory photo^[3]

What it is

The Varian EHPI 500 is a batch-type medium-current ion implanter. The EHPI 500 supports wafer sizes of 150 mm and 200 mm. The ion energy range is from 5 to 260 keV for singly charged ions, and the system can achieve energies up to 780 keV. By 2001, over 550 units of the E-series medium-current implanters were in production.^[2]^[7]^[1]^[6]

How it works

General reference — not yet source-verified

In operation, wafers are loaded from a cassette into a load lock, which is evacuated to vacuum. Wafers are then transferred to the process chamber where the batch platen rotates. The ion beam is scanned across the platen to ensure uniform dose. The system can handle singly and multiply charged ions to achieve a wider range of implant energies.

Applications

General reference — not yet source-verified

Medium-current implanters such as the EHPI 500 are used to dope semiconductor regions in CMOS logic, memory, and mixed-signal devices. Typical applications include forming lightly doped drains, halo implants, and punch-through stop structures.

What do the numbers mean?

Wafer handling5

Maximum wafer size: 200 mm (8 in)^[2]
Wafer size: up to 200 mm^[2]
Wafer size: 8 inch^[1]
Wafer size: 6 inch^[6]
Wafer size capability: up to 200mm^[2]

Performance3

Throughput: Highest industry throughput among medium current implanters (10% higher maximum throughput than previous E-series)^[2]
Throughput increase: 10% higher maximum throughput^[2]
Maximum throughput change: 10% higher maximum throughputs^[2]

Configuration & options17

Medium Current^[1]
Tool type: Medium current ion implanter^[2]
Energy range (single charge, X+): 5 – 260 keV^[2]
Energy range (extended): up to 780 keV^[2]
Minimum feature size: 0.18 µm^[2]
Upgrade / Extensions: BDM (Beam Drift Monitors)^[4]
Consumables at end of lifetime: source electrode^[4]
Contamination Known: BF3, ASH 3, PH 3^[4]
Energy range: up to 780 keV^[2]
Minimum feature size: 0.18 micron^[2]
Manufacturer: Varian^[3]
Model: EHPI 500^[3]
Equipment type: Implanter^[3]
Process class: Medium current ion implanter^[1]
Energy range: 5 - 260 keV^[2]
Expanded energy range: up to 780 keV^[2]
Feature size capability: down to 0.18 micron^[2]

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What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

Applied Materials E 500 EHPI Medium Current— Same function class: Ion Implantation, nullCompare in depthsource^[7]
Applied Materials VIISta 810 XEri— Same function class: Ion Implantation, nullCompare in depthsource^[8]
Applied Materials VIISta 810— Same function class: Ion Implantation, nullCompare in depthsource^[9]
Applied Materials EHP 500— Same function class: Ion Implantation, nullCompare in depthsource^[10]
Applied Materials E 500 HP— Same function class: Ion Implantation, nullCompare in depthsource^[11]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What wafer sizes does the EHPI 500 support?

The system supports 150 mm (6 inch) and 200 mm (8 inch) wafers.^[1]^[6]^[2]

Does the EHPI 500 include statistical process monitoring?

Yes, it includes a statistical quality monitor.^[2]

Not publicly documented

The following facts about the EHPI 500 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the EHPI 500 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the EHPI 500 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the EHPI 500 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the EHPI 500 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the EHPI 500 is not on record.
Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (12)Every fact above is drawn from these public sources

[1]inventory listing
[2]web.archive.org — vsea.com (Jun 16, 2001)web.archive.org
[3]Inventory photo
[4]Inventory photo
[5]Inventory photo
[6]Equipment inventory listing
[7]KR20050086037A - Cassette loading table - Google Patents — patents.google.compatents.google.com
[8]Equipment inventory listing
[9]waferpedia.comwaferpedia.com
[10]Equipment inventory listing
[11]Equipment inventory listing
[12]Equipment inventory listing