Ulvac
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Ulvac Entron EX W 300 is a physical vapor deposition system.[1]
Physical vapor deposition places material into a vacuum environment and transfers it to a substrate as a thin film.
Deposition equipment of this class is used to build thin layers on wafer surfaces by controlled material transport from a source to the workpiece.
Deposition tools sit in the thin-film formation portion of semiconductor processing.
The Ulvac Entron EX W 300 is used for coating steps that follow surface preparation and precede later patterning or integration operations.
Physical vapor deposition equipment is used to form thin films for semiconductor manufacturing.
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
The following facts about the Entron EX W 300 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the Entron EX W 300 are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Entron EX W 300 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Entron EX W 300 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Entron EX W 300 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Entron EX W 300 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Last updated Oct 7, 2026.
The Applied Materials 0010-13622 is an RF match unit intended for PVD (Physical Vapor Deposition) described as a High Efficiency HE RF Match-Bias.
The Applied Materials 0020 12458 Part is an insulator, side match component for the Hdp-Cvd Ultima Plus system.