Ultron
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Ultron UH 114 is a wafer/frame film mounter.[1]
Wafer and frame film mounters apply adhesive film to a wafer that has been mounted on a frame, typically a metal ring, to hold the wafer securely for subsequent dicing processes.
The machine functions by feeding a film from a roll, separating it from a protective liner, and then pressing the film onto the wafer surface and frame edges to create a taut, wrinkle-free membrane.
After a wafer is thinned, it is mounted on a dicing tape frame using a film mounter so that the individual die can be cut apart without chipping or shifting.
Downstream from the mounter, the framed wafer proceeds to a dicing saw or laser grooving system and then to die pick-and-place equipment.
Be the first to add cited specifications for this tool.
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
The Ultron UH 114 is a wafer/frame film mounter.[1]
The following facts about the UH 114 Wafer/Frame Film Mounters are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the UH 114 Wafer/Frame Film Mounters are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UH 114 Wafer/Frame Film Mounters are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the UH 114 Wafer/Frame Film Mounters are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the UH 114 Wafer/Frame Film Mounters are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the UH 114 Wafer/Frame Film Mounters are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Last updated Oct 1, 2026.
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.