Waferpedia

Trion

Apollo

EtchTrion Apollo family
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Provisional entry — research in progress

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TrionApollo
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Power

Yes (RIE biased electrode)[3]

Gas delivery

up to 6 µm/min[1]

What it is

The Trion Apollo is a photoresist stripping and ashing system used in semiconductor manufacturing for the removal of photoresist layers after lithography and etching steps. The system is designed as a compact production tool that can handle a range of wafer sizes from 100 mm to 300 mm.[1][2]

The Apollo incorporates either an inductively coupled plasma (ICP) source or a microwave source, depending on the application requirements. The system is intended for use in production fabs, pilot lines, and research environments where high-rate, low-damage resist removal is needed.[1][2]

How it works

A production-proven multi-axis atmospheric robot with two- or three-link arms provides wafer handling within the system, supporting wafers from 150 mm to 300 mm. The process controller is a PC-based system with graphical software that creates recipes in block-diagram form, stored on 3.5-inch disks. The overall dimensions of the single-chamber system are 18 inches wide by 50 inches deep by 51 inches high.[3]

Applications

The Trion Apollo is applied to photoresist descum and stripping in semiconductor fabrication, including removal of hardened or difficult-to-remove resist layers at low temperatures using RF bias power. The system can achieve etch rates up to 6 micrometers per minute and is suitable for high-throughput production environments.[1][2]

Applications include MEMS device fabrication, compound semiconductor processing, and pilot-line production. The system supports wafer sizes from 100 mm to 300 mm and can be equipped with either ICP or microwave plasma sources to match different process requirements.[1][2]

What do the numbers mean?

Power & electrical1

RF bias
Yes (RIE biased electrode)[3]
Accurate?

Wafer handling4

Wafer size
100mm to 300mm[1]
Accurate?
Chuck type
Electrostatic chuck with helium backside cooling[3]
Accurate?
Wafer handling robot
Multi-axis atmospheric robot; transports 150mm, 200mm, and 300mm wafers[3]
Accurate?
Maximum wafer size (stated in source)
up to 8" (200mm) — note: source also states robot handles 300mm wafers[3]
Accurate?

Gas & chemistry1

Etch rate (photoresist strip)
up to 6 µm/min[1]
Accurate?

Control & software1

Process controller
PC-based with graphical software; recipes stored on 3.5" disks[3]
Accurate?

Dimensions & facilities1

Physical dimensions (W x D x H)
18" x 50" x 51"[3]
Accurate?

Configuration & options2

Plasma source options
Inductively Coupled Plasma (ICP) or SST-Lightning microwave[2]
Accurate?
Tuning
Self-tuning / automatic tuning[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Etch rate (photoresist strip)up to 6 µm/min[1]
  • RF biasYes (RIE biased electrode)[3]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What wafer sizes does the Apollo support?

The Apollo supports wafers from 100mm to 300mm. The robot transports 150mm, 200mm, and 300mm wafers.[1][2][3]

What plasma sources are available for the Apollo?

The Apollo can incorporate either a microwave source (SST-Lightning) or inductively coupled plasma (ICP) technology.[1][2]

What is the maximum photoresist strip rate?

The maximum photoresist etch rate is up to 6 µm/min.[1][2]

Does the Apollo include an electrostatic chuck?

Yes, the Apollo has an electrostatic chuck with helium backside cooling.[3]

Not publicly documented

The following facts about the Apollo are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Apollo are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Apollo are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Apollo are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Apollo are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Apollo is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]triontech.com — triontech.comtriontech.com
  2. [2]triontech.com — triontech.comtriontech.com
  3. [3]semiconductoronline.com — semiconductoronline.comsemiconductoronline.com
  4. [4]Equipment inventory listing
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Last updated Sep 26, 2026.

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