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Tokyo Electron

Telius 304 Polysilicon

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This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Tokyo Electron Telius 304 Polysilicon is a polysilicon etch tool designed for 12-inch (300 mm) wafers.[1][2]

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Fig. — Manufacturer logo, not a photo of this toolWikimedia Commons (see file page for license)

What it is

The Telius 304 Polysilicon is an etch system manufactured by Tokyo Electron. The Telius 304 Polysilicon is configured for 12-inch wafer processing. The Telius 304 Polysilicon is categorized as a polysilicon etch system.[1][2][3]

How it works

General reference — not yet source-verified

The Telius 304 Polysilicon is a plasma etch tool that processes wafers inside a vacuum chamber. Process gases are introduced into the reaction chamber, where an electrical field energizes them into a plasma. Ions and reactive species from the plasma remove exposed polysilicon while the masking material protects the remaining areas.

Etch uniformity across the wafer is controlled by reactor pressure, gas-flow distribution, plasma power, and chamber temperature. The system typically processes wafers individually in a load-locked chamber, which limits exposure to ambient air. Endpoint detection and optical emission monitoring can be used to stop the etch when the polysilicon layer is cleared.

Where it fits in the process flow

General reference — not yet source-verified

The Telius 304 Polysilicon is used in the front end of semiconductor wafer manufacturing. Polysilicon etching follows the deposition of the poly-Si film and the patterning of a photoresist or hard mask. After the etch, subsequent steps include resist removal, cleaning, and thermal processing such as oxidation, silicidation, or dopant activation.

In transistor fabrication, the polysilicon etch defines the gate electrode over the gate dielectric. The same etch step can also define capacitor plates and other poly-Si features in memory cell arrays. Selectivity to the underlying gate oxide and critical-dimension control are primary process requirements for this step.

Applications

General reference — not yet source-verified

The Telius 304 Polysilicon is applied to polysilicon layer patterning in integrated-circuit fabrication. Typical applications include gate electrode etch, capacitor electrode etch, and the formation of polysilicon local interconnects.

The etch process is used on patterned wafers with photoresist masks, oxide hard masks, or nitride masks. Polysilicon etching supports both logic and memory process flows where polycrystalline silicon is a structural layer.

What do the numbers mean?

Wafer handling1

Wafer Sizes
12 inch[1]
Accurate?

Configuration & options3

Make
Tel (Tokyo Electron)[3]
Accurate?
Model
Telius 304[3]
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Category
Etch[3]
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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What type of process does the tool perform?

The tool performs polysilicon etching.[3][1][2]

Not publicly documented

The following facts about the Telius 304 Polysilicon are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Telius 304 Polysilicon are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Telius 304 Polysilicon are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Telius 304 Polysilicon are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Telius 304 Polysilicon are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Telius 304 Polysilicon is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]waferpedia.com — waferpedia.comwaferpedia.com
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Last updated Oct 7, 2026.

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