Tokyo Electron
TE 8500 SATC
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedThe Tokyo Electron TE 8500 SATC is an etch tool designed to remove material from the surface of a semiconductor wafer in a controlled manner.
As a plasma etch system, the TE 8500 SATC uses a plasma of reactive gases to etch the wafer, with the process chamber being a key component.
Where it fits in the process flow
General reference — not yet source-verifiedThe Tokyo Electron TE 8500 SATC is used in the fabrication of integrated circuits, typically after deposition or lithography steps.
The TE 8500 SATC processes wafers through a series of etch steps that define patterns transferred from a photoresist mask.
Applications
General reference — not yet source-verifiedThe Tokyo Electron TE 8500 SATC is used for etching dielectric and metal layers in semiconductor devices.
What do the numbers mean?
Configuration & options4
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| TE 8500 (S)ATC | — | — | — | Equipment inventory listing[2] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
How does this class of machine achieve anisotropic etch profiles?General reference — not yet source-verified
By combining physical ion bombardment (from the plasma) with chemical reactions, and controlling parameters like pressure, gas chemistry, and RF power to create directional etching with minimal lateral removal.
Is this class suitable for high-aspect-ratio etching?General reference — not yet source-verified
Yes, plasma etch systems are designed for high-aspect-ratio features, enabling the formation of deep trenches and dense patterns with vertical sidewalls.
Not publicly documented
The following facts about the TE 8500 SATC are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the TE 8500 SATC are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the TE 8500 SATC are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the TE 8500 SATC are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the TE 8500 SATC is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the TE 8500 SATC are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Equipment inventory listing
- [3]Equipment inventory listing
Last updated Oct 8, 2026.
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