Teradyne
Nextest Magnum I PV
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Teradyne Nextest Magnum I PV is a semiconductor test and probe system. The Teradyne Nextest Magnum I PV is available in a PEXL and DPX20 version with 1xSAB and a diagnostic file available.[1][2]
What it is
How it works
General reference — not yet source-verifiedSemiconductor test and probe systems like the Magnum I PV use automatic test equipment architecture. A test head houses pin electronics that generate test patterns and measure responses. The system interfaces with a wafer prober for wafer-level testing or with a handler for packaged-device final test.
Where it fits in the process flow
General reference — not yet source-verifiedThe Magnum I PV is used in the semiconductor manufacturing flow for electrical testing of integrated circuits. At wafer probe, it tests dice before singulation and packaging. In final test, it verifies packaged devices before shipment.
What do the numbers mean?
Configuration & options6
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Advantest 93000 Smart Scale— Same function class: Test & Probe, UnknownCompare in depthsource[2]
- LTX-Credence ASL 1000— Same function class: Test & Probe, UnknownCompare in depthsource[2]
- Advantest 93000 SOC— Same function class: Test & Probe, UnknownCompare in depthsource[2]
- LTX-Credence ASL 3000— Same function class: Test & Probe, UnknownCompare in depthsource[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Nextest Magnum I PV are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Nextest Magnum I PV are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Nextest Magnum I PV are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Nextest Magnum I PV are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Nextest Magnum I PV are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Nextest Magnum I PV is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Nextest Magnum I PV — Teradyne | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [2]inventory listing
Last updated Oct 10, 2026.
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The Advantest 93000 Smart Scale Tester is a semiconductor test system that includes a Z640 workstation and can be configured with STH or CTH thermal heads and various card types.
The Advantest 93000 SOC Tester is a system-on-chip tester referenced in sources with multiple configurations of infrared, digital, DC, and AC modules.
The LTX / Credence ASL 1000 is an integrated-circuit tester commonly configured with an Electroglas EG 4090 prober for 8-inch wafers.
