Temescal
TES 900
What it is
The Temescal TES 900 is a vertical-process sputtering system within the TES 600/900 series. The system uses a fast cycle dual level load lock that exchanges a completed 12-inch by 12-inch pallet load of substrates with a new pallet load. The pallet travels in a linear motion in front of up to three 5-inch by 15-inch magnetron cathodes. Substrate deposition uniformity of plus or minus five percent is achievable. RF etch and substrate heating are performed in the process chamber.[1]
How it works
The TES 900's pallet scans in front of its rectangular magnetron cathodes to deposit material. The dual level load lock allows continuous operation by exchanging a completed pallet with a new one.[1]
Where it fits in the process flow
General reference — not yet source-verifiedSputtering deposition is typically performed after substrate cleaning and surface preparation and before subsequent photolithography or etching steps. Sputtering is often used to deposit metal layers such as aluminum, titanium, and tungsten, as well as dielectric films.
Applications
General reference — not yet source-verifiedSputtering systems are used to deposit thin films for microelectronics, optical coatings, and wear-resistant layers. Typical deposited materials include metals, metal oxides, and nitrides.
What do the numbers mean?
Power & electrical1
Wafer handling4
Performance1
Configuration & options3
What replaced it?
Related models
- siblingTemescal TES 600— Horizontal-process variant of the same basic platformsource[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- In-situ capabilitiesRF etch and substrate heating in process chamber[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What substrate size does the TES 900 support?
The TES 900 uses a 12-inch by 12-inch pallet for substrates.[1]
How many magnetron cathodes can be installed in the TES 900?
The system can be configured with up to three 5-inch by 15-inch magnetron cathodes.[1]
Does the TES 900 process chamber include additional capabilities?
RF etch and substrate heating are performed in the process chamber.[1]
How does the load lock contribute to operation of the TES 900?
The dual level load lock allows continuous operation by exchanging a completed pallet with a new one.[1]
Not publicly documented
The following facts about the TES 900 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the TES 900 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the TES 900 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the TES 900 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the TES 900 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the TES 900 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]tescal.com — tescal.comtescal.com
Last updated Oct 3, 2026.
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