PA 200 Semi-Automatic

The SUSS MicroTec PA 200 Semi-Automatic is a wafer prober manufactured by SUSS MicroTec and classified under Test & Probe. The PA 200 belongs to the SUSS MicroTec PA 200 family. The PA 200 is configured with a Karl Suss joystick controller and power supply, a Mitutoyo microscope with objectives and eyepiece, an Optem fiber and illuminator, and a Basler Scout infrared camera. Configuration options for the PA 200 include a thermochuck, an anti-vibration table, a Karl Suss manual high-frequency probe head designated PH250HF, probe arms and probe heads, and XYZ Edmund Optic micro positioners.^[1][2]

The PA 200 employs a Mitutoyo microscope with objectives and an eyepiece for viewing the wafer, together with an Optem fiber and illuminator for illumination. A Basler Scout infrared camera provides imaging on the PA 200. The PA 200 includes a thermochuck and an anti-vibration table. Positioning on the PA 200 is performed with a Karl Suss joystick controller and XYZ Edmund Optic micro positioners, and probing is performed with a Karl Suss manual high-frequency probe head designated PH250HF along with probe arms and probe heads.^[1][2]

Wafer probing occupies the wafer-level electrical test stage of semiconductor manufacturing, after wafer fabrication and before dicing and packaging. Measurements taken at this step determine whether devices meet their electrical specifications, and the results feed yield analysis and decisions about which wafers proceed to assembly.

Semi-automatic probers serve development, characterization, and engineering test work, where an operator must reposition probes or inspect devices between measurements. Such tools sit alongside fully automatic probers, which handle production wafer lots, and manual probe stations, which serve the simplest bench measurements.

Wafer probers are used for direct-current parametric measurements such as threshold voltage, leakage current, and resistance, as well as for capacitance and radio-frequency characterization of devices. Probe stations support device modeling, process development, and failure analysis on individual die or on dedicated test structures.

Probing is applied to test structures and product devices on silicon and compound-semiconductor wafers, and to discrete devices placed on a chuck. Optical and infrared imaging extend probing to structures that are hidden beneath opaque layers or that must be accessed from the wafer backside.