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SUSS MicroTec

Mask

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

Mask — Inventory photo
Fig. 01MaskInventory photo[1]

What it is

General reference — not yet source-verified

A mask cleaner is used to clean photomasks and related patterning hardware so they can be handled in lithography workflows.

How it works

Photolithography uses ultraviolet light to transfer patterns from a photomask onto a resist-coated substrate, and wet-processing stations support substrate cleaning, resist coating, development, and removal.[6]

Where it fits in the process flow

Wet-processing and cleanroom stations sit alongside photoresist preparation, substrate cleaning, development, and resist removal in microfabrication workflows.[6][7][8]

Applications

Mask cleaning supports photolithography for semiconductor device fabrication and other microfabrication work that uses patterned exposure.[6][7]

Cleanroom lithography workflows that use masks are applied in microelectronics, photonics, integrated optics, and related device fabrication environments.[6][9]

What do the numbers mean?

Optics & imaging1

Model
Mask Cleaner[1]
Accurate?

Configuration & options3

TXF from OLED[1]
Accurate?
Make
SUSS[1]
Accurate?
Category
Wet Processing / Clean[1]
Accurate?
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Parts & consumables

Tracked replaceable assemblies, spares criticality, and availability status across all major subsystems. Each entry cites its source.

Criticality:
Critical Spare
High
Medium
Consumable
Availability:In ProductionAftermarket OnlyEOL / NLAScarce
General
3 tracked parts
SUSS Mask Aligner Power Supply
In Production[3]
Mask Holder
Different mask holders can be used and swapped by disconnecting the plastic tube and loosening knurled screws
Aftermarket Only[5]
Mask Vacuum System
Vacuum used to hold mask on mask holder; activated by 'Vacuum Mask' button
Aftermarket Only[5]
Process Kit
4 tracked parts
Mask Plate Soda Lime Glass 3x3x0.090 inch
For SUSS MJB-3 contact aligner, max wafer size 3", exposure area 3"x3"
Aftermarket Only[4]
Mask Plate Soda Lime Glass 4x4x0.090 inch
For SUSS MJB-3 or MA-6 contact aligners, supports up to 4" wafer
Aftermarket Only[4]
Mask Plate Soda Lime Glass 5x5x0.090 inch
For SUSS MA-6 contact aligner, supports 3" or 4" wafer
Aftermarket Only[4]
Mask Plate Soda Lime Glass 7x7x0.090 inch
For SUSS MA-6 contact aligner, supports 6" wafer
Aftermarket Only[4]
Wafer Handler
6 tracked parts
Sample Chuck
Sample chuck aligns sample on chuck transport; notch aligns with pin on chuck transport
Aftermarket Only[5]
Chuck Transport
Slides sample chuck left and right for loading and unloading
Aftermarket Only[5]
Z-Height Adjustment Knob
Adjusts sample stage height; one revolution equals 150 micrometers
Aftermarket Only[5]
Contact Lever
Controls contact and release positions between sample and mask
Aftermarket Only[5]
Separation Lever
Controls separation and contact states for alignment
Aftermarket Only[5]
Stage Adjustment Micrometers (X, Y, Theta)
Used for fine alignment of sample position and rotation
Aftermarket Only[5]
Optical
3 tracked parts
1 critical
Microscope Manipulator Rod
Used to position microscope left-right and front-back for alignment
Aftermarket Only[5]
Microscope Light Source
Illuminates mask for alignment
Aftermarket Only[5]
UV Lamp
UV lamp contains mercury; provides UV exposure at 365 nm and 405 nm
Aftermarket Only[5]
Control System
2 tracked parts
Exposure Timer Dial
Sets exposure time with inner dial for scale and outer dial for multiplier
Aftermarket Only[5]
Expose Button
Starts exposure sequence
Aftermarket Only[5]
Scheduled ConsumablesReplace at PM intervals
Mask Plate Soda Lime Glass 3x3x0.090 inch
Mask Plate Soda Lime Glass 4x4x0.090 inch
Mask Plate Soda Lime Glass 5x5x0.090 inch
Mask Plate Soda Lime Glass 7x7x0.090 inch

Where are the manuals?

Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.

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Not publicly documented

Field notes

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Frequently asked questions

What nearby process steps are part of the same workflow?

The same workflow includes substrate cleaning, photoresist spin coating, curing, development, and removal.[6]

What does photolithography do in this context?

Photolithography uses ultraviolet light to transfer patterns from photomasks onto substrates coated with photoresist.[6]

Not publicly documented

The following facts about the Mask are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Mask are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Mask are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Mask are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Mask are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Mask is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (22)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]Equipment inventory listing
  4. [4]wiki.nanofab.ucsb.eduwiki.nanofab.ucsb.edu
  5. [5]wiki.nanofab.ucsb.eduwiki.nanofab.ucsb.edu
  6. [6]Equipment Capabilities - Electrical & Computer Engineering — ece.utoronto.caece.utoronto.ca
  7. [7]ECE Teaching Cleanroom | Electrical and Computer Engineering | UC Santa Barbara — ece.ucsb.eduece.ucsb.edu
  8. [8]Cleanroom Equipment Capabilities and Materials Exclusions | Utah Nanofab — nanofab.utah.edunanofab.utah.edu
  9. [9]Main cleanroom | Quantum-Nano Fabrication and Characterization Facility | University of Waterloo — uwaterloo.cauwaterloo.ca
  10. [10]Facilities | Integrated Nanosystems Research Facility — sites.uci.edusites.uci.edu
  11. [11]Exposure | Stanford Nanofabrication Facility — snfguide.stanford.edusnfguide.stanford.edu
  12. [12]MNTC - Equipment and Facilities | Service Centers — louisville.edulouisville.edu
  13. [13]PHOTO-17: MA-4 Suss Mask Aligner | Equipment | Maryland NanoCenter FabLab — nanocenter.umd.edunanocenter.umd.edu
  14. [14]Lithography — nanolab.berkeley.edunanolab.berkeley.edu
  15. [15]Tool Details - Harvard CNS — cns1.rc.fas.harvard.educns1.rc.fas.harvard.edu
  16. [16]Mask Aligner | Shared Materials Instrumentation Facility — smif.pratt.duke.edusmif.pratt.duke.edu
  17. [17]User Manual — epfl.chepfl.ch
  18. [18]Karl Suss MA6 Aligner | UCLA Nanolab — nanolab.ucla.edunanolab.ucla.edu
  19. [19]Suss MA6 Mask Aligner (system 2) — tmi.utexas.edutmi.utexas.edu
  20. [20]Manual — ncf.uic.eduncf.uic.edu
  21. [21]Lithography — tudelft.nltudelft.nl
  22. [22]SUSS MicroTec (formerly Karl SUSS) - Industry leader in the Advanced Packaging, MEMS and semiconductor markets — suss.com (May 17, 2003)web.archive.org
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Last updated Oct 6, 2026.

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