SUSS MicroTec
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The LabSpin6 / 8 is a manual system for spin coating and puddle developing. The LabSpin6 / 8 handles substrates up to 200 mm.[1]
The LabSpin6 / 8 is a manual spin coating and puddle developing system from SUSS MicroTec that handles wafers up to 200 mm in diameter.[1]
The LabSpin6 / 8 performs spin coating and puddle developing operations as part of a manual process flow.[1]
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The following facts about the LabSpin6 / 8 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the LabSpin6 / 8 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the LabSpin6 / 8 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the LabSpin6 / 8 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the LabSpin6 / 8 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the LabSpin6 / 8 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 22, 2026.
The HP8, CP8, and VP8 are manual coating and developing systems from SUSS MicroTec, supporting wafers up to 200 mm and offering baking, cooling, and vapor priming capabilities.
The Thermo Fisher Scientific / FEI NanoLab 1200 AT FIB is a focused ion beam system with an integrated Electron column and supporting inspection, wafer handling, and gas delivery components.
The ABM-407B-2-S-CE-S293 is a robot.