SUSS MicroTec
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The SUSS MicroTec Gamma is an automated photoresist and wet processing system for photolithography. The Gamma performs DUV photoresist and antireflection coatings, wafer baking, developing, and spray coating for conformal resist wet processing tasks. The Gamma handles wafers from 100mm through 200mm, processing different wafer sizes simultaneously without mechanical changeover.[1][2]
The SUSS MicroTec Gamma is an automated photoresist and wet processing system designed for clean, reliable and high-throughput photolithography processing.[1][2]
The Gamma system is equipped with two wafer cassette stations that accommodate wafers from 100mm through 200mm in size, allowing different wafer sizes to be processed simultaneously without any mechanical changeover.[1]
The Gamma system's configuration is tailored to perform a variety of DUV photoresist and antireflection coatings, wafer baking, developing and spray coating for conformal resist wet processing tasks.[1][2]
The coating module of the Gamma system is primarily dedicated to DUV resist and ARC processing, while manual dispensing of other resists can be arranged.[1]
The Gamma system includes a spray coating module, such as the Alta Spray module, for conformal coating on pieces up to 200mm wafers.[1]
The tool supports DUV photoresist coating, antireflection coating, wafer baking, developing and spray coating, which are steps in the resist processing flow.[1][2]
The Gamma system is compatible with wafers that meet specified requirements, and the backside of wafers must be free of contamination prior to placement in the system.[1]
The Gamma system is used for DUV resist and ARC coating, wafer baking, wafer developing and conformal coating on pieces to 200mm wafers.[1]
The Gamma system processes UV-210 resist coating and baking, DUV42P ARC coating and baking, conformal resist coating with the Alta Spray module, and post exposure baking with 726 MIF developing.[1]
The Gamma is a resist coater and a spray coater, and is part of the SUSS MicroTec GAMMA family of tools.[4]
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The Gamma system supports wafers from 100mm through 200mm, with a maximum substrate size of 8 inches.[1][2]
Different wafer sizes can be processed simultaneously without any mechanical changeover.[1]
The Gamma performs DUV resist and ARC coating, wafer baking, wafer developing and conformal coating on pieces to 200mm wafers.[1]
Processes available include UV-210 resist coating and baking, DUV42P ARC coating and baking, conformal resist coating with the Alta Spray module, and post exposure baking with 726 MIF developing.[1]
The Gamma is compatible with 100mm wafers standard and up to 200mm, but other size wafers must be scheduled with the equipment owners. No warped wafers are allowed, and the backside of wafers must be free of contamination.[1]
The following facts about the Gamma are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Gamma are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Gamma are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Gamma are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Gamma are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Gamma is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 5, 2026.