Shinkawa
UTC 2000
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Shinkawa UTC 2000 is a wire bonder. The Shinkawa UTC 2000 is manufactured by Shinkawa.[1]
What it is
The Shinkawa UTC 2000 is a wire bonder used in semiconductor device packaging.[1]
How it works
General reference — not yet source-verifiedWire bonders connect the bond pads on a semiconductor die to the leads of a package using fine wire. The UTC 2000 is part of this equipment class, performing thermosonic or ultrasonic bonding. A capillary tool feeds the wire and forms a ball bond at the first bond point, then creates a stitch bond at the second bond point before moving to the next connection.
Where it fits in the process flow
General reference — not yet source-verifiedWire bonding is a back-end packaging step that follows wafer dicing and die attach. After the die is mounted to a substrate or leadframe, the wire bonder makes the electrical interconnections. The bonded assembly then proceeds to encapsulation, such as molding or potting, and final test.
What do the numbers mean?
Configuration & options4
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the UTC 2000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UTC 2000 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the UTC 2000 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the UTC 2000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the UTC 2000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the UTC 2000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
Last updated Sep 26, 2026.
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