Rudolph
3Di
The Rudolph 3Di is a 3D and 2D bump inspection and metrology system designed for bumped device manufacturers. The 3Di uses patent-pending RCS technology for 3D inspection and metrology. The 3Di offers high-throughput, high-accuracy, 100% bump and wafer inspection in one system.[1][2]
What it is
How it works
Where it fits in the process flow
The Rudolph 3Di is positioned for post-fab die and wafer inspection.[1]
Applications
The Rudolph 3Di is used for complete bump and wafer inspection, including bump height, coplanarity, and other 3D defects.[1]
The Rudolph 3Di supports all bump processes and materials, under bump metalization, pre- and post-reflow, and other wafer-level packaging inspection tasks such as redistribution lines, thick films, vias, and intermediate interconnects.[1][3]
The Rudolph 3Di handles whole wafers from 75 mm to 300 mm and sawn wafers up to 300 mm on film frames.[1][3]
- Bumped device manufacturing
- 3D bump inspection and metrology
- 2D bump inspection and metrology
- Under bump metalization (UBM)
- Pre- and post-reflow inspection
- Wafer level packaging inspection
- Redistribution lines inspection
- Thick films inspection
- Vias inspection
- Intermediate interconnects inspection
What do the numbers mean?
Wafer handling5
- Inspection capabilities
- Complete high-throughput, high-accuracy, 100% bump and wafer inspection in one system[1]
- Application flexibility
- All bump processes and materials; under bump metalization (UBM); pre- and post-reflow; other wafer level packaging inspection including redistribution lines, thick films, vias, and intermediate interconnects[1]
- Inspection capability
- Complete high-throughput, high-accuracy, 100% bump and wafer inspection in one system[1]
Configuration & options2
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What does the Rudolph 3Di inspect?
The Rudolph 3Di inspects bumps and wafers, and it is aimed at bumped device manufacturing.[1][2]
What kinds of measurements does the Rudolph 3Di make?
The Rudolph 3Di measures bump height, coplanarity, and other 3D defects.[1]
Not publicly documented
The following facts about the 3Di are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 3Di are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 3Di are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 3Di are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 3Di are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 3Di is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]Rudolph 3Di family | Waferpedia — waferpedia.comwaferpedia.com
- [3]3Di — Rudolph | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 5, 2026.
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