Plasma-Therm
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The Plasma-Therm SLR Series is a plasma-enhanced chemical vapor deposition (PECVD) system used for depositing thin films in semiconductor manufacturing.[1]
In a PECVD system, reactive gases are introduced into a vacuum chamber where a radio-frequency (RF) plasma is ignited. The plasma creates energetic electrons and ions that dissociate the process gases into radicals and ions, which then adsorb onto the substrate surface and react to form a solid thin film. The substrate temperature is typically maintained at an intermediate level, lower than in thermal CVD, to allow deposition on temperature-sensitive materials.
The Plasma-Therm SLR Series in its deposition configuration is applied to the deposition of uniform thin films for microelectronic devices, MEMS, and optoelectronic components. Common materials deposited include silicon dioxide, silicon nitride, and other dielectric films used for insulation, protection, and structural layers.
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The Plasma-Therm SLR Series is a plasma-enhanced chemical vapor deposition (PECVD) system, also referred to as a plasma CVD system.[1]
The following facts about the SLR Series are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the SLR Series are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SLR Series are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SLR Series are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SLR Series are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SLR Series are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Sep 29, 2026.
The Applied Materials 0010-13622 is an RF match unit intended for PVD (Physical Vapor Deposition) described as a High Efficiency HE RF Match-Bias.
The Applied Materials 0020 12458 Part is an insulator, side match component for the Hdp-Cvd Ultima Plus system.