NPM W 2 Chip Mounter

The Panasonic NPM W 2 is an electronic assembly system classified as a chip mounter, also known as a pick-and-place machine. The machine is designed for the surface-mount technology (SMT) assembly of printed circuit boards (PCBs). The NPM W 2 integrates functions including component placement, solder paste inspection (SPI), automated optical inspection (AOI), and adhesive dispensing into a single high-speed platform.^[3]

The NPM W 2 is a modular platform that uses exchangeable placement heads, including a 16-nozzle head, a lightweight 8-nozzle head, a 3-nozzle head, an inspection head, and a dispensing head. The machine is equipped with a multi-recognition camera that combines three recognition functions and supports height detection of components, with an option for upgrade from 2D to 3D specifications. A high-rigidity base supports the high-speed placement and accuracy of the system.^[4]

Under optimal conditions, the NPM W 2 can achieve a placement speed of 42,000 components per hour (cph) when using the 16-nozzle head, or a speed of 35,000 cph. The machine supports dual-lane operation for higher area productivity, with selectable placement modes including alternate, independent, and hybrid methods. In high-production mode, the machine's maximum speed can reach 77,000 cph based on IPC9850 standards.^[2][4]

The NPM W 2 can automatically inspect solder deposits and mounted components according to production data, using an inspection head that performs both solder inspection (SPI) and component inspection (AOI). The system also supports an advanced process control (APC) system, designated APC-5M, to manage the variable elements of production. The dispensing head uses a screw-type discharge mechanism for high-quality, non-contact dispensing of adhesive.^[3][4]

The NPM W 2 is a placement machine used in the SMT assembly process flow, positioned after solder paste printing and before reflow soldering. The machine can integrate solder paste inspection (SPI) and automated optical inspection (AOI) functions, allowing it to perform quality checks on the paste before component placement and on the placed components afterwards. The APC system can provide feedback to the printing machine for correction of printing positions and feedforward to the placement machine for correction of placement positions.^[4]

The NPM W 2 handles PCBs with dimensions ranging from 50 mm x 50 mm up to 750 mm x 550 mm in single-lane batch mounting mode. In dual-lane operation, the machine can handle PCBs up to 750 mm x 260 mm for collective processing, or up to 750 mm x 510 mm for single transfer operation. The system supports component supply from tape, stick, and tray feeders, and can accommodate up to 120 feeders for 4 mm or 8 mm tape widths.^[2][3]

The NPM W 2 is used for high-speed placement of surface-mount components onto PCBs in electronics manufacturing. The machine is optimized for larger PCBs and larger components, and can handle components up to 150 mm x 25 mm in size. The system is capable of placing components ranging from 03015 metric chip components up to large packages such as QFPs, BGAs, and CSPs.^[3][4]

The NPM W 2 supports placement of LED components with brightness binning, and it can handle PoP (Package on Package) tray mounting via a transfer unit. The machine is also used for dispensing SMD adhesive, including self-alignment adhesive for fixing larger components during the SMT process. The flexibility of the system allows it to be configured for high-speed or high-accuracy modes depending on the PCB requirements.^[4]