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Oxford Instruments

Ionfab 300 Plus

Metrology & InspectionOxford Instruments Ionfab 300 family
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The Oxford Instruments Ionfab 300 Plus is an ion beam etching and deposition system. The Oxford Instruments Ionfab 300 Plus uses SIMS endpoint detection. The Oxford Instruments Ionfab 300 Plus is specified for 100mm wafers.[1][2][3]

Ionfab 300 Plus — Inventory photo
Fig. 01Ionfab 300 PlusInventory photo[4]

Power

200-1500 V[1]

Vacuum

Cranky Valve, Defect Pressure Gauge[4]

Gas delivery

Ar[1]

What it is

The Oxford Instruments Ionfab 300 Plus is an ion beam system used for ion milling, ion beam etching, and ion beam deposition.[1][2][5][4]

How it works

The Ionfab 300 Plus uses an ion source to direct an argon beam at the substrate for milling or etching, and the system can also support deposition functions.[1][2][5]

The Ionfab 300 Plus includes substrate movement and thermal control features such as continuous rotation, tilt in some holders, clamping, and backside cooling in some configurations.[1][4][2][5]

Where it fits in the process flow

The Ionfab 300 Plus can support chamber processing for single substrates or batches depending on configuration, which makes it relevant for both development work and production-oriented ion beam processing.[1][2][5]

Applications

The Ionfab 300 Plus is used for inert ion milling and ion beam etching on materials such as silicon wafers and metal layers.[1][2][5]

Why won't it start?

Documented failure modes, common issues, and field considerations.

  • Cranky Valve
  • Defect Pressure Gauge

What do the numbers mean?

Power & electrical1

Beam voltage
200-1500 V[1]
Accurate?

Vacuum & pumping3

Few Constraints
Cranky Valve, Defect Pressure Gauge[4]
Accurate?
Base pressure
~2 x 10^-7 mbar[1]
Accurate?
Process pressure
> 8 x 10^-5 mbar[1]
Accurate?

Wafer handling6

Transfer system consists of a load-lock for single substrates[4]
Accurate?
Transfer to chamber succeeds automatically using the machine control system[4]
Accurate?
Substrate is fixed to holder in process chamber by clamping ring[4]
Accurate?
Wafer size
100mm, or pieces attached to a 100mm transfer wafer[1]
Accurate?
Transfer system
Load-lock for single substrates[4]
Accurate?
Substrate holder
Fixed to holder in process chamber by clamping ring[4]
Accurate?

Gas & chemistry1

Gas
Ar[1]
Accurate?

Optics & imaging2

End Point Detector based on mass spectrometer[4]
Accurate?
Endpoint detection
End point detector based on mass spectrometer[4]
Accurate?

Control & software1

Control system, motors, and end-point-detection are operational[4]
Accurate?

Dimensions & facilities1

Holder cooling
Water cooled[4]
Accurate?

Configuration & options15

Ion Source[4]
Accurate?
Diameter
35 cm[4]
Accurate?
2 Ar lines available[4]
Accurate?
One line going to chamber through the neutralizer[4]
Accurate?
Other line going through the plasma chamber[4]
Accurate?
He backside cooling available[4]
Accurate?
Holder is water cooled[4]
Accurate?
Equipment type
Ion beam etching and deposition system[2]
Accurate?
Beam current
1-150 mA[1]
Accurate?
Beam diameter
150 mm or reduced beam diameter using a selection of apertures[1]
Accurate?
Ion source
Ion source with 2 Ar lines available[4]
Accurate?
Ion source diameter
35 cm[4]
Accurate?
Backside cooling
He backside cooling available[4]
Accurate?
Load-lock
Automatic load-lock[1]
Accurate?
Specimen holder motion
Continuous rotation and tilt for directional etching at oblique angles[1]
Accurate?

Vintage & configurations

  1. 1994Owner-stated production year[2]

    One source states the system as '1994 Oxford Ionfab 300 Plus Ion Beam etching/deposition system.'

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Few ConstraintsCranky Valve, Defect Pressure Gauge[4]
  • Beam voltage200-1500 V[1]
  • GasAr[1]
  • Base pressure~2 x 10^-7 mbar[1]
  • Process pressure> 8 x 10^-5 mbar[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

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Frequently asked questions

What is the beam current range of the Ionfab 300 Plus?

The beam current range is 1-150 mA, depending on the beam diameter and choice of grids.[1]

What types of endpoint detection does the system support?

The system supports end point detection based on a mass spectrometer, which is used for process monitoring.[4]

Does the system support both etching and deposition?

Yes, the Ionfab 300 Plus is an ion beam etching and deposition system, with dual beam configurations for etching plus deposition.[2]

Not publicly documented

The following facts about the Ionfab 300 Plus are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented variants, configuration options, or revision breakpoints of the Ionfab 300 Plus are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Ionfab 300 Plus are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • The process node or technology generation of the Ionfab 300 Plus is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the Ionfab 300 Plus are on record.

    Answerable by: an OEM parts catalog or a service engineer

  • No publicly hosted manuals, SOPs, or datasheets for the Ionfab 300 Plus are on record.

    Answerable by: university cleanroom staff or an OEM application specialist

Sources & citations

Sources (7)Every fact above is drawn from these public sources
  1. [1]labbokning.mc2.chalmers.se — labbokning.mc2.chalmers.selabbokning.mc2.chalmers.se
  2. [2]semistarcorp.com — semistarcorp.comsemistarcorp.com
  3. [3]OXFORD Ionfab 300 Plus Ion beam etch and deposition system, 4-8 | SemiStar — semistarcorp.comsemistarcorp.com
  4. [4]Inventory photo
  5. [5]Oxford instruments Ionfab 300 Plus Ion Beam etching & deposition system | SemiStar — semistarcorp.comsemistarcorp.com
  6. [6]Etching: CAIBE System (Oxford Ionfab300Plus) - A*STAR Scientific Equipment & Services Finder (A*SEF) — search.rsc.a-star.edu.sgsearch.rsc.a-star.edu.sg
  7. [7]Compound Semiconductor: Oxford Instruments — oxinst.com (Jan 3, 2011)web.archive.org
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Last updated Oct 6, 2026.

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