Oxford Instruments
80-etch
The Oxford Instruments 80-etch is a cleanroom etching and deposition tool used for PECVD and dry etch processes. The Oxford Instruments 80-etch has one controller for both RIE and PECVD. The Oxford Instruments 80-etch supports source gases SiH4, N2, N2O, NH3, and Ar.[1][2]
What it is
How it works
General reference — not yet source-verifiedEtch tools in this class remove or shape material from wafers and thin films by using plasma, reactive gases, or wet chemistry to transfer a pattern into the target layer.
Where it fits in the process flow
General reference — not yet source-verifiedEtch systems sit after pattern definition and before later device completion steps, because they transfer lithographic patterns into exposed films or substrate materials.
What can it run?
Process applications and technology nodes documented for this tool.
- Wafer or thin film etching/patterning
- DRIE
- XeF2 dry silicon isotropic etch
- O2 plasma
- Wet chemical etching
- PECVD
What do the numbers mean?
Wafer handling1
Gas & chemistry2
Control & software1
Configuration & options6
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 80-etch are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 80-etch are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 80-etch are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 80-etch are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 80-etch are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 80-etch is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Oxford Instruments 80-etch family | Waferpedia — waferpedia.comwaferpedia.com
- [2]nanofab.utah.edu — nanofab.utah.edunanofab.utah.edu
- [3]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 5, 2026.
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