Onto Innovation
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Onto Innovation / Rudolph AXI 930 is a macro inspection system that detects wafer-level and die-level defects. The AXI 930 supports wafers up to 8 inches and is configured with 2 load ports.[1]
The AXI 930 is a macro inspection system for semiconductor wafers.[1]
The AXI 930 is used for wafer level defect detection.[1]
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The AXI 930 is used as a macro inspection system to detect wafer level and die level defects.[1]
The following facts about the AXI 930 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AXI 930 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the AXI 930 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the AXI 930 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the AXI 930 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the AXI 930 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 24, 2026.