Mydata
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The MY 9 SMT is an SMT assembly machine manufactured by Mydata.[1]
The MY 9 SMT operates as a typical pick-and-place system. Components stored in tape-and-reel or tray feeders are picked by a placement head that may use multiple nozzles. A vision system inspects each component and locates fiducial marks on the PCB to correct placement coordinates. The head then rotates the component to the required angle and lowers it onto solder paste deposits on the board.
The MY 9 SMT is positioned in the SMT assembly line after the solder paste printing stage and before the reflow soldering oven. A screen printer deposits solder paste on the PCB pads, then the pick-and-place machine mounts components on the paste. Following placement, the board passes through a reflow oven where the solder is melted to form permanent electrical and mechanical connections.
Upstream processes include solder paste printing and optionally adhesive dispensing for wave-solder components. Downstream processes may include reflow soldering, cleaning, and inspection steps such as automated optical inspection (AOI).
Typical applications include prototyping, low-volume high-mix production, and pilot runs where flexibility and quick setup are prioritized over maximum throughput.
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
The MY 9 SMT is manufactured by Mydata and produced under the Mycronic brand following Mycronic's acquisition of Mydata.[1]
The MY 9 SMT is categorized under Assembly / SMT equipment.[1]
Typical applications include prototyping, low-volume high-mix production, and pilot runs where flexibility and quick setup are prioritized over maximum throughput.[1]
The MY 9 SMT operates as a typical pick-and-place system, with components picked from tape-and-reel or tray feeders by a placement head that may use multiple nozzles, a vision system that inspects each component and locates fiducial marks on the PCB, and a head that rotates the component and lowers it onto solder paste deposits.[1]
The MY 9 SMT is positioned after the solder paste printing stage and before the reflow soldering oven.[1]
The following facts about the MY 9 SMT are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the MY 9 SMT are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MY 9 SMT are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the MY 9 SMT are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the MY 9 SMT are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MY 9 SMT are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Last updated Oct 6, 2026.
The Dek 03 iX Automatic is an automatic paste printer used in surface-mount technology assembly.