Lam Research
The Lam AutoEtch 590 is an in-line cassette to cassette, fully automated, single wafer, double air-locked, parallel plate plasma etching system. The Lam AutoEtch 590 is designed for automatic plasma etching applications with cassette-to-cassette wafer transfer capability. The Lam AutoEtch 590 supports programmable process parameters including RF power, chamber pressure, gas flow control, electrode spacing, and multi-step process recipes.[1][2][3]
Wafer size
6"
Power
ENI OEM 12[1]
The Lam Research AutoEtch 590 is a plasma etching system for semiconductor wafer processing. The AutoEtch 590 is a cassette-to-cassette, fully automated, single-wafer, double-airlocked, parallel-plate plasma etching system.[1][3][2]
The AutoEtch 590 moves a wafer from a send cassette into an entrance station, through an entrance airlock, and into the process chamber. The wafer is then etched by a computer-controlled gas plasma discharge and transferred through an exit airlock to a receive cassette.[1][2]
The AutoEtch 590 uses closed-loop automatic control. The programmable process variables include operating pressure, RF power, electrode spacing, gas flow rates, and step-terminating modes.[1][2]
The AutoEtch 590 sits in the etch segment of semiconductor manufacturing, where it removes selected film material after lithography has defined the pattern on the wafer. The tool transfers wafers between cassettes and the process chamber without exposing the chamber to ambient conditions during the etch cycle.[1][2][3]
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The following facts about the AutoEtch 590 plasma etcher plasma etch semiconductor are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AutoEtch 590 plasma etcher plasma etch semiconductor are on record.
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Last updated Oct 9, 2026.
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