Kulicke & Soffa
IConn Plus
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Kulicke & Soffa IConn Plus Wire Bonder is a wire bonding tool. The IConn Plus operates at 50/60 Hz and has an interrupt capacity of 5000 A at 200-240 VAC and an over current rating of 100 A/10 ms at 200-240 VAC.[1][2]
What it is
General reference — not yet source-verifiedWire bonders are machines used in semiconductor packaging to electrically interconnect the integrated circuit die to the package substrate or leadframe using fine metal wires.
How it works
General reference — not yet source-verifiedWire bonders create interconnections by feeding fine wire through a capillary or wedge tool. The wire is bonded to the first bond pad using a combination of heat, ultrasonic energy, and pressure, then looped to the second bond pad where it is similarly bonded. The wire is then cut to form the next connection.
Where it fits in the process flow
General reference — not yet source-verifiedWire bonding is a back-end assembly step in semiconductor manufacturing. After wafers are diced into individual dies, the dies are attached to a package substrate or leadframe. Wire bonding then connects the bond pads on the die to the leads or substrate pads. Subsequent steps include encapsulation or molding, singulation, and final test.
What do the numbers mean?
Power & electrical3
- 50/60 Hz[1]
Configuration & options6
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the IConn Plus are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the IConn Plus are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the IConn Plus are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the IConn Plus are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the IConn Plus are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the IConn Plus is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (11)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]K&S - 日本語 - Bonding Tools — kns.com (Mar 8, 2016)web.archive.org
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
- [7]Inventory photo
- [8]Inventory photo
- [9]Inventory photo
- [10]Inventory photo
- [11]Equipment inventory listing
Last updated Oct 2, 2026.
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